diff options
Diffstat (limited to 'qemu/roms/u-boot/include/ddr_spd.h')
| -rw-r--r-- | qemu/roms/u-boot/include/ddr_spd.h | 565 |
1 files changed, 565 insertions, 0 deletions
diff --git a/qemu/roms/u-boot/include/ddr_spd.h b/qemu/roms/u-boot/include/ddr_spd.h new file mode 100644 index 000000000..cf2aac6ae --- /dev/null +++ b/qemu/roms/u-boot/include/ddr_spd.h @@ -0,0 +1,565 @@ +/* + * Copyright 2008-2014 Freescale Semiconductor, Inc. + * + * This program is free software; you can redistribute it and/or + * modify it under the terms of the GNU General Public License + * Version 2 as published by the Free Software Foundation. + */ + +#ifndef _DDR_SPD_H_ +#define _DDR_SPD_H_ + +/* + * Format from "JEDEC Standard No. 21-C, + * Appendix D: Rev 1.0: SPD's for DDR SDRAM + */ +typedef struct ddr1_spd_eeprom_s { + unsigned char info_size; /* 0 # bytes written into serial memory */ + unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ + unsigned char mem_type; /* 2 Fundamental memory type */ + unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ + unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ + unsigned char nrows; /* 5 Number of DIMM Banks */ + unsigned char dataw_lsb; /* 6 Data Width of this assembly */ + unsigned char dataw_msb; /* 7 ... Data Width continuation */ + unsigned char voltage; /* 8 Voltage intf std of this assembly */ + unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ + unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ + unsigned char config; /* 11 DIMM Configuration type */ + unsigned char refresh; /* 12 Refresh Rate/Type */ + unsigned char primw; /* 13 Primary SDRAM Width */ + unsigned char ecw; /* 14 Error Checking SDRAM width */ + unsigned char min_delay; /* 15 for Back to Back Random Address */ + unsigned char burstl; /* 16 Burst Lengths Supported */ + unsigned char nbanks; /* 17 # of Banks on SDRAM Device */ + unsigned char cas_lat; /* 18 CAS# Latencies Supported */ + unsigned char cs_lat; /* 19 CS# Latency */ + unsigned char write_lat; /* 20 Write Latency (aka Write Recovery) */ + unsigned char mod_attr; /* 21 SDRAM Module Attributes */ + unsigned char dev_attr; /* 22 SDRAM Device Attributes */ + unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-0.5 */ + unsigned char clk_access2; /* 24 SDRAM Access from + Clk @ CL=X-0.5 (tAC) */ + unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-1 */ + unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */ + unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ + unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ + unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ + unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ + unsigned char bank_dens; /* 31 Density of each bank on module */ + unsigned char ca_setup; /* 32 Addr + Cmd Setup Time Before Clk */ + unsigned char ca_hold; /* 33 Addr + Cmd Hold Time After Clk */ + unsigned char data_setup; /* 34 Data Input Setup Time Before Strobe */ + unsigned char data_hold; /* 35 Data Input Hold Time After Strobe */ + unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */ + unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ + unsigned char trfc; /* 42 Min Auto to Active period tRFC */ + unsigned char tckmax; /* 43 Max device cycle time tCKmax */ + unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ + unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ + unsigned char res_46; /* 46 Reserved */ + unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */ + unsigned char res_48_61[14]; /* 48-61 Reserved */ + unsigned char spd_rev; /* 62 SPD Data Revision Code */ + unsigned char cksum; /* 63 Checksum for bytes 0-62 */ + unsigned char mid[8]; /* 64-71 Mfr's JEDEC ID code per JEP-106 */ + unsigned char mloc; /* 72 Manufacturing Location */ + unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ + unsigned char rev[2]; /* 91 Revision Code */ + unsigned char mdate[2]; /* 93 Manufacturing Date */ + unsigned char sernum[4]; /* 95 Assembly Serial Number */ + unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ + +} ddr1_spd_eeprom_t; + +/* + * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM", + * SPD Revision 1.2 + */ +typedef struct ddr2_spd_eeprom_s { + unsigned char info_size; /* 0 # bytes written into serial memory */ + unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ + unsigned char mem_type; /* 2 Fundamental memory type */ + unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ + unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ + unsigned char mod_ranks; /* 5 Number of DIMM Ranks */ + unsigned char dataw; /* 6 Module Data Width */ + unsigned char res_7; /* 7 Reserved */ + unsigned char voltage; /* 8 Voltage intf std of this assembly */ + unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ + unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ + unsigned char config; /* 11 DIMM Configuration type */ + unsigned char refresh; /* 12 Refresh Rate/Type */ + unsigned char primw; /* 13 Primary SDRAM Width */ + unsigned char ecw; /* 14 Error Checking SDRAM width */ + unsigned char res_15; /* 15 Reserved */ + unsigned char burstl; /* 16 Burst Lengths Supported */ + unsigned char nbanks; /* 17 # of Banks on Each SDRAM Device */ + unsigned char cas_lat; /* 18 CAS# Latencies Supported */ + unsigned char mech_char; /* 19 DIMM Mechanical Characteristics */ + unsigned char dimm_type; /* 20 DIMM type information */ + unsigned char mod_attr; /* 21 SDRAM Module Attributes */ + unsigned char dev_attr; /* 22 SDRAM Device Attributes */ + unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */ + unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */ + unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */ + unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */ + unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ + unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ + unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ + unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ + unsigned char rank_dens; /* 31 Density of each rank on module */ + unsigned char ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */ + unsigned char ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */ + unsigned char data_setup; /* 34 Data Input Setup Time + Before Strobe (tDS) */ + unsigned char data_hold; /* 35 Data Input Hold Time + After Strobe (tDH) */ + unsigned char twr; /* 36 Write Recovery time tWR */ + unsigned char twtr; /* 37 Int write to read delay tWTR */ + unsigned char trtp; /* 38 Int read to precharge delay tRTP */ + unsigned char mem_probe; /* 39 Mem analysis probe characteristics */ + unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */ + unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ + unsigned char trfc; /* 42 Min Auto to Active period tRFC */ + unsigned char tckmax; /* 43 Max device cycle time tCKmax */ + unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ + unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ + unsigned char pll_relock; /* 46 PLL Relock time */ + unsigned char t_casemax; /* 47 Tcasemax */ + unsigned char psi_ta_dram; /* 48 Thermal Resistance of DRAM Package from + Top (Case) to Ambient (Psi T-A DRAM) */ + unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient + due to Activate-Precharge/Mode Bits + (DT0/Mode Bits) */ + unsigned char dt2n_dt2q; /* 50 DRAM Case Temperature Rise from Ambient + due to Precharge/Quiet Standby + (DT2N/DT2Q) */ + unsigned char dt2p; /* 51 DRAM Case Temperature Rise from Ambient + due to Precharge Power-Down (DT2P) */ + unsigned char dt3n; /* 52 DRAM Case Temperature Rise from Ambient + due to Active Standby (DT3N) */ + unsigned char dt3pfast; /* 53 DRAM Case Temperature Rise from Ambient + due to Active Power-Down with + Fast PDN Exit (DT3Pfast) */ + unsigned char dt3pslow; /* 54 DRAM Case Temperature Rise from Ambient + due to Active Power-Down with Slow + PDN Exit (DT3Pslow) */ + unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient + due to Page Open Burst Read/DT4R4W + Mode Bit (DT4R/DT4R4W Mode Bit) */ + unsigned char dt5b; /* 56 DRAM Case Temperature Rise from Ambient + due to Burst Refresh (DT5B) */ + unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient + due to Bank Interleave Reads with + Auto-Precharge (DT7) */ + unsigned char psi_ta_pll; /* 58 Thermal Resistance of PLL Package form + Top (Case) to Ambient (Psi T-A PLL) */ + unsigned char psi_ta_reg; /* 59 Thermal Reisitance of Register Package + from Top (Case) to Ambient + (Psi T-A Register) */ + unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient + due to PLL Active (DT PLL Active) */ + unsigned char dtregact; /* 61 Register Case Temperature Rise from + Ambient due to Register Active/Mode Bit + (DT Register Active/Mode Bit) */ + unsigned char spd_rev; /* 62 SPD Data Revision Code */ + unsigned char cksum; /* 63 Checksum for bytes 0-62 */ + unsigned char mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */ + unsigned char mloc; /* 72 Manufacturing Location */ + unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ + unsigned char rev[2]; /* 91 Revision Code */ + unsigned char mdate[2]; /* 93 Manufacturing Date */ + unsigned char sernum[4]; /* 95 Assembly Serial Number */ + unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ + +} ddr2_spd_eeprom_t; + +typedef struct ddr3_spd_eeprom_s { + /* General Section: Bytes 0-59 */ + unsigned char info_size_crc; /* 0 # bytes written into serial memory, + CRC coverage */ + unsigned char spd_rev; /* 1 Total # bytes of SPD mem device */ + unsigned char mem_type; /* 2 Key Byte / Fundamental mem type */ + unsigned char module_type; /* 3 Key Byte / Module Type */ + unsigned char density_banks; /* 4 SDRAM Density and Banks */ + unsigned char addressing; /* 5 SDRAM Addressing */ + unsigned char module_vdd; /* 6 Module nominal voltage, VDD */ + unsigned char organization; /* 7 Module Organization */ + unsigned char bus_width; /* 8 Module Memory Bus Width */ + unsigned char ftb_div; /* 9 Fine Timebase (FTB) + Dividend / Divisor */ + unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */ + unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */ + unsigned char tck_min; /* 12 SDRAM Minimum Cycle Time */ + unsigned char res_13; /* 13 Reserved */ + unsigned char caslat_lsb; /* 14 CAS Latencies Supported, + Least Significant Byte */ + unsigned char caslat_msb; /* 15 CAS Latencies Supported, + Most Significant Byte */ + unsigned char taa_min; /* 16 Min CAS Latency Time */ + unsigned char twr_min; /* 17 Min Write REcovery Time */ + unsigned char trcd_min; /* 18 Min RAS# to CAS# Delay Time */ + unsigned char trrd_min; /* 19 Min Row Active to + Row Active Delay Time */ + unsigned char trp_min; /* 20 Min Row Precharge Delay Time */ + unsigned char tras_trc_ext; /* 21 Upper Nibbles for tRAS and tRC */ + unsigned char tras_min_lsb; /* 22 Min Active to Precharge + Delay Time */ + unsigned char trc_min_lsb; /* 23 Min Active to Active/Refresh + Delay Time, LSB */ + unsigned char trfc_min_lsb; /* 24 Min Refresh Recovery Delay Time */ + unsigned char trfc_min_msb; /* 25 Min Refresh Recovery Delay Time */ + unsigned char twtr_min; /* 26 Min Internal Write to + Read Command Delay Time */ + unsigned char trtp_min; /* 27 Min Internal Read to Precharge + Command Delay Time */ + unsigned char tfaw_msb; /* 28 Upper Nibble for tFAW */ + unsigned char tfaw_min; /* 29 Min Four Activate Window + Delay Time*/ + unsigned char opt_features; /* 30 SDRAM Optional Features */ + unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */ + unsigned char therm_sensor; /* 32 Module Thermal Sensor */ + unsigned char device_type; /* 33 SDRAM device type */ + int8_t fine_tck_min; /* 34 Fine offset for tCKmin */ + int8_t fine_taa_min; /* 35 Fine offset for tAAmin */ + int8_t fine_trcd_min; /* 36 Fine offset for tRCDmin */ + int8_t fine_trp_min; /* 37 Fine offset for tRPmin */ + int8_t fine_trc_min; /* 38 Fine offset for tRCmin */ + unsigned char res_39_59[21]; /* 39-59 Reserved, General Section */ + + /* Module-Specific Section: Bytes 60-116 */ + union { + struct { + /* 60 (Unbuffered) Module Nominal Height */ + unsigned char mod_height; + /* 61 (Unbuffered) Module Maximum Thickness */ + unsigned char mod_thickness; + /* 62 (Unbuffered) Reference Raw Card Used */ + unsigned char ref_raw_card; + /* 63 (Unbuffered) Address Mapping from + Edge Connector to DRAM */ + unsigned char addr_mapping; + /* 64-116 (Unbuffered) Reserved */ + unsigned char res_64_116[53]; + } unbuffered; + struct { + /* 60 (Registered) Module Nominal Height */ + unsigned char mod_height; + /* 61 (Registered) Module Maximum Thickness */ + unsigned char mod_thickness; + /* 62 (Registered) Reference Raw Card Used */ + unsigned char ref_raw_card; + /* 63 DIMM Module Attributes */ + unsigned char modu_attr; + /* 64 RDIMM Thermal Heat Spreader Solution */ + unsigned char thermal; + /* 65 Register Manufacturer ID Code, Least Significant Byte */ + unsigned char reg_id_lo; + /* 66 Register Manufacturer ID Code, Most Significant Byte */ + unsigned char reg_id_hi; + /* 67 Register Revision Number */ + unsigned char reg_rev; + /* 68 Register Type */ + unsigned char reg_type; + /* 69-76 RC1,3,5...15 (MS Nibble) / RC0,2,4...14 (LS Nibble) */ + unsigned char rcw[8]; + } registered; + unsigned char uc[57]; /* 60-116 Module-Specific Section */ + } mod_section; + + /* Unique Module ID: Bytes 117-125 */ + unsigned char mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */ + unsigned char mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */ + unsigned char mloc; /* 119 Mfg Location */ + unsigned char mdate[2]; /* 120-121 Mfg Date */ + unsigned char sernum[4]; /* 122-125 Module Serial Number */ + + /* CRC: Bytes 126-127 */ + unsigned char crc[2]; /* 126-127 SPD CRC */ + + /* Other Manufacturer Fields and User Space: Bytes 128-255 */ + unsigned char mpart[18]; /* 128-145 Mfg's Module Part Number */ + unsigned char mrev[2]; /* 146-147 Module Revision Code */ + + unsigned char dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */ + unsigned char dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */ + + unsigned char msd[26]; /* 150-175 Mfg's Specific Data */ + unsigned char cust[80]; /* 176-255 Open for Customer Use */ + +} ddr3_spd_eeprom_t; + +/* From JEEC Standard No. 21-C release 23A */ +struct ddr4_spd_eeprom_s { + /* General Section: Bytes 0-127 */ + uint8_t info_size_crc; /* 0 # bytes */ + uint8_t spd_rev; /* 1 Total # bytes of SPD */ + uint8_t mem_type; /* 2 Key Byte / mem type */ + uint8_t module_type; /* 3 Key Byte / Module Type */ + uint8_t density_banks; /* 4 Density and Banks */ + uint8_t addressing; /* 5 Addressing */ + uint8_t package_type; /* 6 Package type */ + uint8_t opt_feature; /* 7 Optional features */ + uint8_t thermal_ref; /* 8 Thermal and refresh */ + uint8_t oth_opt_features; /* 9 Other optional features */ + uint8_t res_10; /* 10 Reserved */ + uint8_t module_vdd; /* 11 Module nominal voltage */ + uint8_t organization; /* 12 Module Organization */ + uint8_t bus_width; /* 13 Module Memory Bus Width */ + uint8_t therm_sensor; /* 14 Module Thermal Sensor */ + uint8_t ext_type; /* 15 Extended module type */ + uint8_t res_16; + uint8_t timebases; /* 17 MTb and FTB */ + uint8_t tck_min; /* 18 tCKAVGmin */ + uint8_t tck_max; /* 19 TCKAVGmax */ + uint8_t caslat_b1; /* 20 CAS latencies, 1st byte */ + uint8_t caslat_b2; /* 21 CAS latencies, 2nd byte */ + uint8_t caslat_b3; /* 22 CAS latencies, 3rd byte */ + uint8_t caslat_b4; /* 23 CAS latencies, 4th byte */ + uint8_t taa_min; /* 24 Min CAS Latency Time */ + uint8_t trcd_min; /* 25 Min RAS# to CAS# Delay Time */ + uint8_t trp_min; /* 26 Min Row Precharge Delay Time */ + uint8_t tras_trc_ext; /* 27 Upper Nibbles for tRAS and tRC */ + uint8_t tras_min_lsb; /* 28 tRASmin, lsb */ + uint8_t trc_min_lsb; /* 29 tRCmin, lsb */ + uint8_t trfc1_min_lsb; /* 30 Min Refresh Recovery Delay Time */ + uint8_t trfc1_min_msb; /* 31 Min Refresh Recovery Delay Time */ + uint8_t trfc2_min_lsb; /* 32 Min Refresh Recovery Delay Time */ + uint8_t trfc2_min_msb; /* 33 Min Refresh Recovery Delay Time */ + uint8_t trfc4_min_lsb; /* 34 Min Refresh Recovery Delay Time */ + uint8_t trfc4_min_msb; /* 35 Min Refresh Recovery Delay Time */ + uint8_t tfaw_msb; /* 36 Upper Nibble for tFAW */ + uint8_t tfaw_min; /* 37 tFAW, lsb */ + uint8_t trrds_min; /* 38 tRRD_Smin, MTB */ + uint8_t trrdl_min; /* 39 tRRD_Lmin, MTB */ + uint8_t tccdl_min; /* 40 tCCS_Lmin, MTB */ + uint8_t res_41[60-41]; /* 41 Rserved */ + uint8_t mapping[78-60]; /* 60~77 Connector to SDRAM bit map */ + uint8_t res_78[117-78]; /* 78~116, Reserved */ + int8_t fine_tccdl_min; /* 117 Fine offset for tCCD_Lmin */ + int8_t fine_trrdl_min; /* 118 Fine offset for tRRD_Lmin */ + int8_t fine_trrds_min; /* 119 Fine offset for tRRD_Smin */ + int8_t fine_trc_min; /* 120 Fine offset for tRCmin */ + int8_t fine_trp_min; /* 121 Fine offset for tRPmin */ + int8_t fine_trcd_min; /* 122 Fine offset for tRCDmin */ + int8_t fine_taa_min; /* 123 Fine offset for tAAmin */ + int8_t fine_tck_max; /* 124 Fine offset for tCKAVGmax */ + int8_t fine_tck_min; /* 125 Fine offset for tCKAVGmin */ + /* CRC: Bytes 126-127 */ + uint8_t crc[2]; /* 126-127 SPD CRC */ + + /* Module-Specific Section: Bytes 128-255 */ + union { + struct { + /* 128 (Unbuffered) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Unbuffered) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Unbuffered) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 (Unbuffered) Address Mapping from + Edge Connector to DRAM */ + uint8_t addr_mapping; + /* 132~253 (Unbuffered) Reserved */ + uint8_t res_132[254-132]; + /* 254~255 CRC */ + uint8_t crc[2]; + } unbuffered; + struct { + /* 128 (Registered) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Registered) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Registered) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 DIMM Module Attributes */ + uint8_t modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + uint8_t thermal; + /* 133 Register Manufacturer ID Code, LSB */ + uint8_t reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + uint8_t reg_id_hi; + /* 135 Register Revision Number */ + uint8_t reg_rev; + /* 136 Address mapping from register to DRAM */ + uint8_t reg_map; + /* 137~253 Reserved */ + uint8_t res_137[254-137]; + /* 254~255 CRC */ + uint8_t crc[2]; + } registered; + struct { + /* 128 (Loadreduced) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Loadreduced) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Loadreduced) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 DIMM Module Attributes */ + uint8_t modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + uint8_t thermal; + /* 133 Register Manufacturer ID Code, LSB */ + uint8_t reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + uint8_t reg_id_hi; + /* 135 Register Revision Number */ + uint8_t reg_rev; + /* 136 Address mapping from register to DRAM */ + uint8_t reg_map; + /* 137 Register Output Drive Strength for CMD/Add*/ + uint8_t reg_drv; + /* 138 Register Output Drive Strength for CK */ + uint8_t reg_drv_ck; + /* 139 Data Buffer Revision Number */ + uint8_t data_buf_rev; + /* 140 DRAM VrefDQ for Package Rank 0 */ + uint8_t vrefqe_r0; + /* 141 DRAM VrefDQ for Package Rank 1 */ + uint8_t vrefqe_r1; + /* 142 DRAM VrefDQ for Package Rank 2 */ + uint8_t vrefqe_r2; + /* 143 DRAM VrefDQ for Package Rank 3 */ + uint8_t vrefqe_r3; + /* 144 Data Buffer VrefDQ for DRAM Interface */ + uint8_t data_intf; + /* + * 145 Data Buffer MDQ Drive Strength and RTT + * for data rate <= 1866 + */ + uint8_t data_drv_1866; + /* + * 146 Data Buffer MDQ Drive Strength and RTT + * for 1866 < data rate <= 2400 + */ + uint8_t data_drv_2400; + /* + * 147 Data Buffer MDQ Drive Strength and RTT + * for 2400 < data rate <= 3200 + */ + uint8_t data_drv_3200; + /* 148 DRAM Drive Strength */ + uint8_t dram_drv; + /* + * 149 DRAM ODT (RTT_WR, RTT_NOM) + * for data rate <= 1866 + */ + uint8_t dram_odt_1866; + /* + * 150 DRAM ODT (RTT_WR, RTT_NOM) + * for 1866 < data rate <= 2400 + */ + uint8_t dram_odt_2400; + /* + * 151 DRAM ODT (RTT_WR, RTT_NOM) + * for 2400 < data rate <= 3200 + */ + uint8_t dram_odt_3200; + /* + * 152 DRAM ODT (RTT_PARK) + * for data rate <= 1866 + */ + uint8_t dram_odt_park_1866; + /* + * 153 DRAM ODT (RTT_PARK) + * for 1866 < data rate <= 2400 + */ + uint8_t dram_odt_park_2400; + /* + * 154 DRAM ODT (RTT_PARK) + * for 2400 < data rate <= 3200 + */ + uint8_t dram_odt_park_3200; + uint8_t res_155[254-155]; /* Reserved */ + /* 254~255 CRC */ + uint8_t crc[2]; + } loadreduced; + uint8_t uc[128]; /* 128-255 Module-Specific Section */ + } mod_section; + + uint8_t res_256[320-256]; /* 256~319 Reserved */ + + /* Module supplier's data: Byte 320~383 */ + uint8_t mmid_lsb; /* 320 Module MfgID Code LSB */ + uint8_t mmid_msb; /* 321 Module MfgID Code MSB */ + uint8_t mloc; /* 322 Mfg Location */ + uint8_t mdate[2]; /* 323~324 Mfg Date */ + uint8_t sernum[4]; /* 325~328 Module Serial Number */ + uint8_t mpart[20]; /* 329~348 Mfg's Module Part Number */ + uint8_t mrev; /* 349 Module Revision Code */ + uint8_t dmid_lsb; /* 350 DRAM MfgID Code LSB */ + uint8_t dmid_msb; /* 351 DRAM MfgID Code MSB */ + uint8_t stepping; /* 352 DRAM stepping */ + uint8_t msd[29]; /* 353~381 Mfg's Specific Data */ + uint8_t res_382[2]; /* 382~383 Reserved */ + + uint8_t user[512-384]; /* 384~511 End User Programmable */ +}; + +extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd); +extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd); +extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd); +extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd); +extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd); +unsigned int ddr4_spd_check(const struct ddr4_spd_eeprom_s *spd); + +/* + * Byte 2 Fundamental Memory Types. + */ +#define SPD_MEMTYPE_FPM (0x01) +#define SPD_MEMTYPE_EDO (0x02) +#define SPD_MEMTYPE_PIPE_NIBBLE (0x03) +#define SPD_MEMTYPE_SDRAM (0x04) +#define SPD_MEMTYPE_ROM (0x05) +#define SPD_MEMTYPE_SGRAM (0x06) +#define SPD_MEMTYPE_DDR (0x07) +#define SPD_MEMTYPE_DDR2 (0x08) +#define SPD_MEMTYPE_DDR2_FBDIMM (0x09) +#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A) +#define SPD_MEMTYPE_DDR3 (0x0B) +#define SPD_MEMTYPE_DDR4 (0x0C) + +/* DIMM Type for DDR2 SPD (according to v1.3) */ +#define DDR2_SPD_DIMMTYPE_UNDEFINED (0x00) +#define DDR2_SPD_DIMMTYPE_RDIMM (0x01) +#define DDR2_SPD_DIMMTYPE_UDIMM (0x02) +#define DDR2_SPD_DIMMTYPE_SO_DIMM (0x04) +#define DDR2_SPD_DIMMTYPE_72B_SO_CDIMM (0x06) +#define DDR2_SPD_DIMMTYPE_72B_SO_RDIMM (0x07) +#define DDR2_SPD_DIMMTYPE_MICRO_DIMM (0x08) +#define DDR2_SPD_DIMMTYPE_MINI_RDIMM (0x10) +#define DDR2_SPD_DIMMTYPE_MINI_UDIMM (0x20) + +/* Byte 3 Key Byte / Module Type for DDR3 SPD */ +#define DDR3_SPD_MODULETYPE_MASK (0x0f) +#define DDR3_SPD_MODULETYPE_RDIMM (0x01) +#define DDR3_SPD_MODULETYPE_UDIMM (0x02) +#define DDR3_SPD_MODULETYPE_SO_DIMM (0x03) +#define DDR3_SPD_MODULETYPE_MICRO_DIMM (0x04) +#define DDR3_SPD_MODULETYPE_MINI_RDIMM (0x05) +#define DDR3_SPD_MODULETYPE_MINI_UDIMM (0x06) +#define DDR3_SPD_MODULETYPE_MINI_CDIMM (0x07) +#define DDR3_SPD_MODULETYPE_72B_SO_UDIMM (0x08) +#define DDR3_SPD_MODULETYPE_72B_SO_RDIMM (0x09) +#define DDR3_SPD_MODULETYPE_72B_SO_CDIMM (0x0A) +#define DDR3_SPD_MODULETYPE_LRDIMM (0x0B) +#define DDR3_SPD_MODULETYPE_16B_SO_DIMM (0x0C) +#define DDR3_SPD_MODULETYPE_32B_SO_DIMM (0x0D) + +/* DIMM Type for DDR4 SPD */ +#define DDR4_SPD_MODULETYPE_MASK (0x0f) +#define DDR4_SPD_MODULETYPE_EXT (0x00) +#define DDR4_SPD_MODULETYPE_RDIMM (0x01) +#define DDR4_SPD_MODULETYPE_UDIMM (0x02) +#define DDR4_SPD_MODULETYPE_SO_DIMM (0x03) +#define DDR4_SPD_MODULETYPE_LRDIMM (0x04) +#define DDR4_SPD_MODULETYPE_MINI_RDIMM (0x05) +#define DDR4_SPD_MODULETYPE_MINI_UDIMM (0x06) +#define DDR4_SPD_MODULETYPE_72B_SO_UDIMM (0x08) +#define DDR4_SPD_MODULETYPE_72B_SO_RDIMM (0x09) +#define DDR4_SPD_MODULETYPE_16B_SO_DIMM (0x0C) +#define DDR4_SPD_MODULETYPE_32B_SO_DIMM (0x0D) + +#endif /* _DDR_SPD_H_ */ |