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-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/armada-thermal.txt24
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/db8500-thermal.txt44
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/dove-thermal.txt18
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/exynos-thermal.txt121
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/imx-thermal.txt24
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt15
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/rcar-thermal.txt38
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt68
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/spear-thermal.txt14
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/st-thermal.txt42
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/tegra-soctherm.txt55
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/thermal.txt595
-rw-r--r--kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt74
13 files changed, 1132 insertions, 0 deletions
diff --git a/kernel/Documentation/devicetree/bindings/thermal/armada-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/armada-thermal.txt
new file mode 100644
index 000000000..4698e0edc
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/armada-thermal.txt
@@ -0,0 +1,24 @@
+* Marvell Armada 370/375/380/XP thermal management
+
+Required properties:
+
+- compatible: Should be set to one of the following:
+ marvell,armada370-thermal
+ marvell,armada375-thermal
+ marvell,armada380-thermal
+ marvell,armadaxp-thermal
+
+- reg: Device's register space.
+ Two entries are expected, see the examples below.
+ The first one is required for the sensor register;
+ the second one is required for the control register
+ to be used for sensor initialization (a.k.a. calibration).
+
+Example:
+
+ thermal@d0018300 {
+ compatible = "marvell,armada370-thermal";
+ reg = <0xd0018300 0x4
+ 0xd0018304 0x4>;
+ status = "okay";
+ };
diff --git a/kernel/Documentation/devicetree/bindings/thermal/db8500-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
new file mode 100644
index 000000000..2e1c06fad
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
@@ -0,0 +1,44 @@
+* ST-Ericsson DB8500 Thermal
+
+** Thermal node properties:
+
+- compatible : "stericsson,db8500-thermal";
+- reg : address range of the thermal sensor registers;
+- interrupts : interrupts generated from PRCMU;
+- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH";
+- num-trips : number of total trip points, this is required, set it 0 if none,
+ if greater than 0, the following properties must be defined;
+- tripN-temp : temperature of trip point N, should be in ascending order;
+- tripN-type : type of trip point N, should be one of "active" "passive" "hot"
+ "critical";
+- tripN-cdev-num : number of the cooling devices which can be bound to trip
+ point N, this is required if trip point N is defined, set it 0 if none,
+ otherwise the following cooling device names must be defined;
+- tripN-cdev-nameM : name of the No. M cooling device of trip point N;
+
+Usually the num-trips and tripN-*** are separated in board related dts files.
+
+Example:
+thermal@801573c0 {
+ compatible = "stericsson,db8500-thermal";
+ reg = <0x801573c0 0x40>;
+ interrupts = <21 0x4>, <22 0x4>;
+ interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";
+
+ num-trips = <3>;
+
+ trip0-temp = <75000>;
+ trip0-type = "active";
+ trip0-cdev-num = <1>;
+ trip0-cdev-name0 = "thermal-cpufreq-0";
+
+ trip1-temp = <80000>;
+ trip1-type = "active";
+ trip1-cdev-num = <2>;
+ trip1-cdev-name0 = "thermal-cpufreq-0";
+ trip1-cdev-name1 = "thermal-fan";
+
+ trip2-temp = <85000>;
+ trip2-type = "critical";
+ trip2-cdev-num = <0>;
+}
diff --git a/kernel/Documentation/devicetree/bindings/thermal/dove-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/dove-thermal.txt
new file mode 100644
index 000000000..6f474677d
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/dove-thermal.txt
@@ -0,0 +1,18 @@
+* Dove Thermal
+
+This driver is for Dove SoCs which contain a thermal sensor.
+
+Required properties:
+- compatible : "marvell,dove-thermal"
+- reg : Address range of the thermal registers
+
+The reg properties should contain two ranges. The first is for the
+three Thermal Manager registers, while the second range contains the
+Thermal Diode Control Registers.
+
+Example:
+
+ thermal@10078 {
+ compatible = "marvell,dove-thermal";
+ reg = <0xd001c 0x0c>, <0xd005c 0x08>;
+ };
diff --git a/kernel/Documentation/devicetree/bindings/thermal/exynos-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/exynos-thermal.txt
new file mode 100644
index 000000000..695150a41
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/exynos-thermal.txt
@@ -0,0 +1,121 @@
+* Exynos Thermal Management Unit (TMU)
+
+** Required properties:
+
+- compatible : One of the following:
+ "samsung,exynos3250-tmu"
+ "samsung,exynos4412-tmu"
+ "samsung,exynos4210-tmu"
+ "samsung,exynos5250-tmu"
+ "samsung,exynos5260-tmu"
+ "samsung,exynos5420-tmu" for TMU channel 0, 1 on Exynos5420
+ "samsung,exynos5420-tmu-ext-triminfo" for TMU channels 2, 3 and 4
+ Exynos5420 (Must pass triminfo base and triminfo clock)
+ "samsung,exynos5440-tmu"
+ "samsung,exynos7-tmu"
+- interrupt-parent : The phandle for the interrupt controller
+- reg : Address range of the thermal registers. For soc's which has multiple
+ instances of TMU and some registers are shared across all TMU's like
+ interrupt related then 2 set of register has to supplied. First set
+ belongs to register set of TMU instance and second set belongs to
+ registers shared with the TMU instance.
+
+ NOTE: On Exynos5420, the TRIMINFO register is misplaced for TMU
+ channels 2, 3 and 4
+ Use "samsung,exynos5420-tmu-ext-triminfo" in cases, there is a misplaced
+ register, also provide clock to access that base.
+
+ TRIMINFO at 0x1006c000 contains data for TMU channel 3
+ TRIMINFO at 0x100a0000 contains data for TMU channel 4
+ TRIMINFO at 0x10068000 contains data for TMU channel 2
+
+- interrupts : Should contain interrupt for thermal system
+- clocks : The main clocks for TMU device
+ -- 1. operational clock for TMU channel
+ -- 2. optional clock to access the shared registers of TMU channel
+ -- 3. optional special clock for functional operation
+- clock-names : Thermal system clock name
+ -- "tmu_apbif" operational clock for current TMU channel
+ -- "tmu_triminfo_apbif" clock to access the shared triminfo register
+ for current TMU channel
+ -- "tmu_sclk" clock for functional operation of the current TMU
+ channel
+- vtmu-supply: This entry is optional and provides the regulator node supplying
+ voltage to TMU. If needed this entry can be placed inside
+ board/platform specific dts file.
+Following properties are mandatory (depending on SoC):
+- samsung,tmu_gain: Gain value for internal TMU operation.
+- samsung,tmu_reference_voltage: Value of TMU IP block's reference voltage
+- samsung,tmu_noise_cancel_mode: Mode for noise cancellation
+- samsung,tmu_efuse_value: Default level of temperature - it is needed when
+ in factory fusing produced wrong value
+- samsung,tmu_min_efuse_value: Minimum temperature fused value
+- samsung,tmu_max_efuse_value: Maximum temperature fused value
+- samsung,tmu_first_point_trim: First point trimming value
+- samsung,tmu_second_point_trim: Second point trimming value
+- samsung,tmu_default_temp_offset: Default temperature offset
+- samsung,tmu_cal_type: Callibration type
+
+Example 1):
+
+ tmu@100C0000 {
+ compatible = "samsung,exynos4412-tmu";
+ interrupt-parent = <&combiner>;
+ reg = <0x100C0000 0x100>;
+ interrupts = <2 4>;
+ clocks = <&clock 383>;
+ clock-names = "tmu_apbif";
+ status = "disabled";
+ vtmu-supply = <&tmu_regulator_node>;
+ #include "exynos4412-tmu-sensor-conf.dtsi"
+ };
+
+Example 2):
+
+ tmuctrl_0: tmuctrl@160118 {
+ compatible = "samsung,exynos5440-tmu";
+ reg = <0x160118 0x230>, <0x160368 0x10>;
+ interrupts = <0 58 0>;
+ clocks = <&clock 21>;
+ clock-names = "tmu_apbif";
+ #include "exynos5440-tmu-sensor-conf.dtsi"
+ };
+
+Example 3): (In case of Exynos5420 "with misplaced TRIMINFO register")
+ tmu_cpu2: tmu@10068000 {
+ compatible = "samsung,exynos5420-tmu-ext-triminfo";
+ reg = <0x10068000 0x100>, <0x1006c000 0x4>;
+ interrupts = <0 184 0>;
+ clocks = <&clock 318>, <&clock 318>;
+ clock-names = "tmu_apbif", "tmu_triminfo_apbif";
+ #include "exynos4412-tmu-sensor-conf.dtsi"
+ };
+
+ tmu_cpu3: tmu@1006c000 {
+ compatible = "samsung,exynos5420-tmu-ext-triminfo";
+ reg = <0x1006c000 0x100>, <0x100a0000 0x4>;
+ interrupts = <0 185 0>;
+ clocks = <&clock 318>, <&clock 319>;
+ clock-names = "tmu_apbif", "tmu_triminfo_apbif";
+ #include "exynos4412-tmu-sensor-conf.dtsi"
+ };
+
+ tmu_gpu: tmu@100a0000 {
+ compatible = "samsung,exynos5420-tmu-ext-triminfo";
+ reg = <0x100a0000 0x100>, <0x10068000 0x4>;
+ interrupts = <0 215 0>;
+ clocks = <&clock 319>, <&clock 318>;
+ clock-names = "tmu_apbif", "tmu_triminfo_apbif";
+ #include "exynos4412-tmu-sensor-conf.dtsi"
+ };
+
+Note: For multi-instance tmu each instance should have an alias correctly
+numbered in "aliases" node.
+
+Example:
+
+aliases {
+ tmuctrl0 = &tmuctrl_0;
+ tmuctrl1 = &tmuctrl_1;
+ tmuctrl2 = &tmuctrl_2;
+};
diff --git a/kernel/Documentation/devicetree/bindings/thermal/imx-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/imx-thermal.txt
new file mode 100644
index 000000000..3c67bd50a
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/imx-thermal.txt
@@ -0,0 +1,24 @@
+* Temperature Monitor (TEMPMON) on Freescale i.MX SoCs
+
+Required properties:
+- compatible : "fsl,imx6q-tempmon" for i.MX6Q, "fsl,imx6sx-tempmon" for i.MX6SX.
+ i.MX6SX has two more IRQs than i.MX6Q, one is IRQ_LOW and the other is IRQ_PANIC,
+ when temperature is below than low threshold, IRQ_LOW will be triggered, when temperature
+ is higher than panic threshold, system will auto reboot by SRC module.
+- fsl,tempmon : phandle pointer to system controller that contains TEMPMON
+ control registers, e.g. ANATOP on imx6q.
+- fsl,tempmon-data : phandle pointer to fuse controller that contains TEMPMON
+ calibration data, e.g. OCOTP on imx6q. The details about calibration data
+ can be found in SoC Reference Manual.
+
+Optional properties:
+- clocks : thermal sensor's clock source.
+
+Example:
+
+tempmon {
+ compatible = "fsl,imx6q-tempmon";
+ fsl,tempmon = <&anatop>;
+ fsl,tempmon-data = <&ocotp>;
+ clocks = <&clks 172>;
+};
diff --git a/kernel/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt
new file mode 100644
index 000000000..8c0f5eb86
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt
@@ -0,0 +1,15 @@
+* Kirkwood Thermal
+
+This version is for Kirkwood 88F8262 & 88F6283 SoCs. Other kirkwoods
+don't contain a thermal sensor.
+
+Required properties:
+- compatible : "marvell,kirkwood-thermal"
+- reg : Address range of the thermal registers
+
+Example:
+
+ thermal@10078 {
+ compatible = "marvell,kirkwood-thermal";
+ reg = <0x10078 0x4>;
+ };
diff --git a/kernel/Documentation/devicetree/bindings/thermal/rcar-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/rcar-thermal.txt
new file mode 100644
index 000000000..332e625f6
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/rcar-thermal.txt
@@ -0,0 +1,38 @@
+* Renesas R-Car Thermal
+
+Required properties:
+- compatible : "renesas,thermal-<soctype>", "renesas,rcar-thermal"
+ as fallback.
+ Examples with soctypes are:
+ - "renesas,thermal-r8a73a4" (R-Mobile APE6)
+ - "renesas,thermal-r8a7779" (R-Car H1)
+ - "renesas,thermal-r8a7790" (R-Car H2)
+ - "renesas,thermal-r8a7791" (R-Car M2-W)
+ - "renesas,thermal-r8a7792" (R-Car V2H)
+ - "renesas,thermal-r8a7793" (R-Car M2-N)
+ - "renesas,thermal-r8a7794" (R-Car E2)
+- reg : Address range of the thermal registers.
+ The 1st reg will be recognized as common register
+ if it has "interrupts".
+
+Option properties:
+
+- interrupts : use interrupt
+
+Example (non interrupt support):
+
+thermal@ffc48000 {
+ compatible = "renesas,thermal-r8a7779", "renesas,rcar-thermal";
+ reg = <0xffc48000 0x38>;
+};
+
+Example (interrupt support):
+
+thermal@e61f0000 {
+ compatible = "renesas,thermal-r8a73a4", "renesas,rcar-thermal";
+ reg = <0xe61f0000 0x14
+ 0xe61f0100 0x38
+ 0xe61f0200 0x38
+ 0xe61f0300 0x38>;
+ interrupts = <0 69 IRQ_TYPE_LEVEL_HIGH>;
+};
diff --git a/kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
new file mode 100644
index 000000000..ef802de49
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
@@ -0,0 +1,68 @@
+* Temperature Sensor ADC (TSADC) on rockchip SoCs
+
+Required properties:
+- compatible : "rockchip,rk3288-tsadc"
+- reg : physical base address of the controller and length of memory mapped
+ region.
+- interrupts : The interrupt number to the cpu. The interrupt specifier format
+ depends on the interrupt controller.
+- clocks : Must contain an entry for each entry in clock-names.
+- clock-names : Shall be "tsadc" for the converter-clock, and "apb_pclk" for
+ the peripheral clock.
+- resets : Must contain an entry for each entry in reset-names.
+ See ../reset/reset.txt for details.
+- reset-names : Must include the name "tsadc-apb".
+- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description.
+- rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value.
+- rockchip,hw-tshut-mode : The hardware-controlled shutdown mode 0:CRU 1:GPIO.
+- rockchip,hw-tshut-polarity : The hardware-controlled active polarity 0:LOW
+ 1:HIGH.
+
+Exiample:
+tsadc: tsadc@ff280000 {
+ compatible = "rockchip,rk3288-tsadc";
+ reg = <0xff280000 0x100>;
+ interrupts = <GIC_SPI 37 IRQ_TYPE_LEVEL_HIGH>;
+ clocks = <&cru SCLK_TSADC>, <&cru PCLK_TSADC>;
+ clock-names = "tsadc", "apb_pclk";
+ resets = <&cru SRST_TSADC>;
+ reset-names = "tsadc-apb";
+ pinctrl-names = "default";
+ pinctrl-0 = <&otp_out>;
+ #thermal-sensor-cells = <1>;
+ rockchip,hw-tshut-temp = <95000>;
+ rockchip,hw-tshut-mode = <0>;
+ rockchip,hw-tshut-polarity = <0>;
+};
+
+Example: referring to thermal sensors:
+thermal-zones {
+ cpu_thermal: cpu_thermal {
+ polling-delay-passive = <1000>; /* milliseconds */
+ polling-delay = <5000>; /* milliseconds */
+
+ /* sensor ID */
+ thermal-sensors = <&tsadc 1>;
+
+ trips {
+ cpu_alert0: cpu_alert {
+ temperature = <70000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ cpu_crit: cpu_crit {
+ temperature = <90000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_alert0>;
+ cooling-device =
+ <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
+ };
+};
diff --git a/kernel/Documentation/devicetree/bindings/thermal/spear-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/spear-thermal.txt
new file mode 100644
index 000000000..93e3b67c1
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/spear-thermal.txt
@@ -0,0 +1,14 @@
+* SPEAr Thermal
+
+Required properties:
+- compatible : "st,thermal-spear1340"
+- reg : Address range of the thermal registers
+- st,thermal-flags: flags used to enable thermal sensor
+
+Example:
+
+ thermal@fc000000 {
+ compatible = "st,thermal-spear1340";
+ reg = <0xfc000000 0x1000>;
+ st,thermal-flags = <0x7000>;
+ };
diff --git a/kernel/Documentation/devicetree/bindings/thermal/st-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/st-thermal.txt
new file mode 100644
index 000000000..3b9251b4a
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/st-thermal.txt
@@ -0,0 +1,42 @@
+Binding for Thermal Sensor driver for STMicroelectronics STi series of SoCs.
+
+Required parameters:
+-------------------
+
+compatible : st,<SoC>-<module>-thermal; should be one of:
+ "st,stih415-sas-thermal",
+ "st,stih415-mpe-thermal",
+ "st,stih416-sas-thermal"
+ "st,stih416-mpe-thermal"
+ "st,stid127-thermal" or
+ "st,stih407-thermal"
+ according to the SoC type (stih415, stih416, stid127, stih407)
+ and module type (sas or mpe). On stid127 & stih407 there is only
+ one die/module, so there is no module type in the compatible
+ string.
+clock-names : Should be "thermal".
+ See: Documentation/devicetree/bindings/resource-names.txt
+clocks : Phandle of the clock used by the thermal sensor.
+ See: Documentation/devicetree/bindings/clock/clock-bindings.txt
+
+Optional parameters:
+-------------------
+
+reg : For non-sysconf based sensors, this should be the physical base
+ address and length of the sensor's registers.
+interrupts : Standard way to define interrupt number.
+ Interrupt is mandatory to be defined when compatible is
+ "stih416-mpe-thermal".
+ NB: For thermal sensor's for which no interrupt has been
+ defined, a polling delay of 1000ms will be used to read the
+ temperature from device.
+
+Example:
+
+ temp1@fdfe8000 {
+ compatible = "st,stih416-mpe-thermal";
+ reg = <0xfdfe8000 0x10>;
+ clock-names = "thermal";
+ clocks = <&clk_m_mpethsens>;
+ interrupts = <GIC_SPI 23 IRQ_TYPE_NONE>;
+ };
diff --git a/kernel/Documentation/devicetree/bindings/thermal/tegra-soctherm.txt b/kernel/Documentation/devicetree/bindings/thermal/tegra-soctherm.txt
new file mode 100644
index 000000000..6b68cd150
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/tegra-soctherm.txt
@@ -0,0 +1,55 @@
+Tegra124 SOCTHERM thermal management system
+
+The SOCTHERM IP block contains thermal sensors, support for polled
+or interrupt-based thermal monitoring, CPU and GPU throttling based
+on temperature trip points, and handling external overcurrent
+notifications. It is also used to manage emergency shutdown in an
+overheating situation.
+
+Required properties :
+- compatible : For Tegra124, must contain "nvidia,tegra124-soctherm".
+ For Tegra132, must contain "nvidia,tegra132-soctherm".
+ For Tegra210, must contain "nvidia,tegra210-soctherm".
+- reg : Should contain 1 entry:
+ - SOCTHERM register set
+- interrupts : Defines the interrupt used by SOCTHERM
+- clocks : Must contain an entry for each entry in clock-names.
+ See ../clocks/clock-bindings.txt for details.
+- clock-names : Must include the following entries:
+ - tsensor
+ - soctherm
+- resets : Must contain an entry for each entry in reset-names.
+ See ../reset/reset.txt for details.
+- reset-names : Must include the following entries:
+ - soctherm
+- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description
+ of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
+ list of valid values when referring to thermal sensors.
+
+
+Example :
+
+ soctherm@0,700e2000 {
+ compatible = "nvidia,tegra124-soctherm";
+ reg = <0x0 0x700e2000 0x0 0x1000>;
+ interrupts = <GIC_SPI 48 IRQ_TYPE_LEVEL_HIGH>;
+ clocks = <&tegra_car TEGRA124_CLK_TSENSOR>,
+ <&tegra_car TEGRA124_CLK_SOC_THERM>;
+ clock-names = "tsensor", "soctherm";
+ resets = <&tegra_car 78>;
+ reset-names = "soctherm";
+
+ #thermal-sensor-cells = <1>;
+ };
+
+Example: referring to thermal sensors :
+
+ thermal-zones {
+ cpu {
+ polling-delay-passive = <1000>;
+ polling-delay = <1000>;
+
+ thermal-sensors =
+ <&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>;
+ };
+ };
diff --git a/kernel/Documentation/devicetree/bindings/thermal/thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/thermal.txt
new file mode 100644
index 000000000..29fe0bfae
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/thermal.txt
@@ -0,0 +1,595 @@
+* Thermal Framework Device Tree descriptor
+
+This file describes a generic binding to provide a way of
+defining hardware thermal structure using device tree.
+A thermal structure includes thermal zones and their components,
+such as trip points, polling intervals, sensors and cooling devices
+binding descriptors.
+
+The target of device tree thermal descriptors is to describe only
+the hardware thermal aspects. The thermal device tree bindings are
+not about how the system must control or which algorithm or policy
+must be taken in place.
+
+There are five types of nodes involved to describe thermal bindings:
+- thermal sensors: devices which may be used to take temperature
+ measurements.
+- cooling devices: devices which may be used to dissipate heat.
+- trip points: describe key temperatures at which cooling is recommended. The
+ set of points should be chosen based on hardware limits.
+- cooling maps: used to describe links between trip points and cooling devices;
+- thermal zones: used to describe thermal data within the hardware;
+
+The following is a description of each of these node types.
+
+* Thermal sensor devices
+
+Thermal sensor devices are nodes providing temperature sensing capabilities on
+thermal zones. Typical devices are I2C ADC converters and bandgaps. These are
+nodes providing temperature data to thermal zones. Thermal sensor devices may
+control one or more internal sensors.
+
+Required property:
+- #thermal-sensor-cells: Used to provide sensor device specific information
+ Type: unsigned while referring to it. Typically 0 on thermal sensor
+ Size: one cell nodes with only one sensor, and at least 1 on nodes
+ with several internal sensors, in order
+ to identify uniquely the sensor instances within
+ the IC. See thermal zone binding for more details
+ on how consumers refer to sensor devices.
+
+* Cooling device nodes
+
+Cooling devices are nodes providing control on power dissipation. There
+are essentially two ways to provide control on power dissipation. First
+is by means of regulating device performance, which is known as passive
+cooling. A typical passive cooling is a CPU that has dynamic voltage and
+frequency scaling (DVFS), and uses lower frequencies as cooling states.
+Second is by means of activating devices in order to remove
+the dissipated heat, which is known as active cooling, e.g. regulating
+fan speeds. In both cases, cooling devices shall have a way to determine
+the state of cooling in which the device is.
+
+Any cooling device has a range of cooling states (i.e. different levels
+of heat dissipation). For example a fan's cooling states correspond to
+the different fan speeds possible. Cooling states are referred to by
+single unsigned integers, where larger numbers mean greater heat
+dissipation. The precise set of cooling states associated with a device
+(as referred to be the cooling-min-state and cooling-max-state
+properties) should be defined in a particular device's binding.
+For more examples of cooling devices, refer to the example sections below.
+
+Required properties:
+- cooling-min-state: An integer indicating the smallest
+ Type: unsigned cooling state accepted. Typically 0.
+ Size: one cell
+
+- cooling-max-state: An integer indicating the largest
+ Type: unsigned cooling state accepted.
+ Size: one cell
+
+- #cooling-cells: Used to provide cooling device specific information
+ Type: unsigned while referring to it. Must be at least 2, in order
+ Size: one cell to specify minimum and maximum cooling state used
+ in the reference. The first cell is the minimum
+ cooling state requested and the second cell is
+ the maximum cooling state requested in the reference.
+ See Cooling device maps section below for more details
+ on how consumers refer to cooling devices.
+
+* Trip points
+
+The trip node is a node to describe a point in the temperature domain
+in which the system takes an action. This node describes just the point,
+not the action.
+
+Required properties:
+- temperature: An integer indicating the trip temperature level,
+ Type: signed in millicelsius.
+ Size: one cell
+
+- hysteresis: A low hysteresis value on temperature property (above).
+ Type: unsigned This is a relative value, in millicelsius.
+ Size: one cell
+
+- type: a string containing the trip type. Expected values are:
+ "active": A trip point to enable active cooling
+ "passive": A trip point to enable passive cooling
+ "hot": A trip point to notify emergency
+ "critical": Hardware not reliable.
+ Type: string
+
+* Cooling device maps
+
+The cooling device maps node is a node to describe how cooling devices
+get assigned to trip points of the zone. The cooling devices are expected
+to be loaded in the target system.
+
+Required properties:
+- cooling-device: A phandle of a cooling device with its specifier,
+ Type: phandle + referring to which cooling device is used in this
+ cooling specifier binding. In the cooling specifier, the first cell
+ is the minimum cooling state and the second cell
+ is the maximum cooling state used in this map.
+- trip: A phandle of a trip point node within the same thermal
+ Type: phandle of zone.
+ trip point node
+
+Optional property:
+- contribution: The cooling contribution to the thermal zone of the
+ Type: unsigned referred cooling device at the referred trip point.
+ Size: one cell The contribution is a ratio of the sum
+ of all cooling contributions within a thermal zone.
+
+Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
+limit specifier means:
+(i) - minimum state allowed for minimum cooling state used in the reference.
+(ii) - maximum state allowed for maximum cooling state used in the reference.
+Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
+
+* Thermal zone nodes
+
+The thermal zone node is the node containing all the required info
+for describing a thermal zone, including its cooling device bindings. The
+thermal zone node must contain, apart from its own properties, one sub-node
+containing trip nodes and one sub-node containing all the zone cooling maps.
+
+Required properties:
+- polling-delay: The maximum number of milliseconds to wait between polls
+ Type: unsigned when checking this thermal zone.
+ Size: one cell
+
+- polling-delay-passive: The maximum number of milliseconds to wait
+ Type: unsigned between polls when performing passive cooling.
+ Size: one cell
+
+- thermal-sensors: A list of thermal sensor phandles and sensor specifier
+ Type: list of used while monitoring the thermal zone.
+ phandles + sensor
+ specifier
+
+- trips: A sub-node which is a container of only trip point nodes
+ Type: sub-node required to describe the thermal zone.
+
+- cooling-maps: A sub-node which is a container of only cooling device
+ Type: sub-node map nodes, used to describe the relation between trips
+ and cooling devices.
+
+Optional property:
+- coefficients: An array of integers (one signed cell) containing
+ Type: array coefficients to compose a linear relation between
+ Elem size: one cell the sensors listed in the thermal-sensors property.
+ Elem type: signed Coefficients defaults to 1, in case this property
+ is not specified. A simple linear polynomial is used:
+ Z = c0 * x0 + c1 + x1 + ... + c(n-1) * x(n-1) + cn.
+
+ The coefficients are ordered and they match with sensors
+ by means of sensor ID. Additional coefficients are
+ interpreted as constant offset.
+
+Note: The delay properties are bound to the maximum dT/dt (temperature
+derivative over time) in two situations for a thermal zone:
+(i) - when passive cooling is activated (polling-delay-passive); and
+(ii) - when the zone just needs to be monitored (polling-delay) or
+when active cooling is activated.
+
+The maximum dT/dt is highly bound to hardware power consumption and dissipation
+capability. The delays should be chosen to account for said max dT/dt,
+such that a device does not cross several trip boundaries unexpectedly
+between polls. Choosing the right polling delays shall avoid having the
+device in temperature ranges that may damage the silicon structures and
+reduce silicon lifetime.
+
+* The thermal-zones node
+
+The "thermal-zones" node is a container for all thermal zone nodes. It shall
+contain only sub-nodes describing thermal zones as in the section
+"Thermal zone nodes". The "thermal-zones" node appears under "/".
+
+* Examples
+
+Below are several examples on how to use thermal data descriptors
+using device tree bindings:
+
+(a) - CPU thermal zone
+
+The CPU thermal zone example below describes how to setup one thermal zone
+using one single sensor as temperature source and many cooling devices and
+power dissipation control sources.
+
+#include <dt-bindings/thermal/thermal.h>
+
+cpus {
+ /*
+ * Here is an example of describing a cooling device for a DVFS
+ * capable CPU. The CPU node describes its four OPPs.
+ * The cooling states possible are 0..3, and they are
+ * used as OPP indexes. The minimum cooling state is 0, which means
+ * all four OPPs can be available to the system. The maximum
+ * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V)
+ * can be available in the system.
+ */
+ cpu0: cpu@0 {
+ ...
+ operating-points = <
+ /* kHz uV */
+ 970000 1200000
+ 792000 1100000
+ 396000 950000
+ 198000 850000
+ >;
+ cooling-min-state = <0>;
+ cooling-max-state = <3>;
+ #cooling-cells = <2>; /* min followed by max */
+ };
+ ...
+};
+
+&i2c1 {
+ ...
+ /*
+ * A simple fan controller which supports 10 speeds of operation
+ * (represented as 0-9).
+ */
+ fan0: fan@0x48 {
+ ...
+ cooling-min-state = <0>;
+ cooling-max-state = <9>;
+ #cooling-cells = <2>; /* min followed by max */
+ };
+};
+
+ocp {
+ ...
+ /*
+ * A simple IC with a single bandgap temperature sensor.
+ */
+ bandgap0: bandgap@0x0000ED00 {
+ ...
+ #thermal-sensor-cells = <0>;
+ };
+};
+
+thermal-zones {
+ cpu_thermal: cpu-thermal {
+ polling-delay-passive = <250>; /* milliseconds */
+ polling-delay = <1000>; /* milliseconds */
+
+ thermal-sensors = <&bandgap0>;
+
+ trips {
+ cpu_alert0: cpu-alert0 {
+ temperature = <90000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "active";
+ };
+ cpu_alert1: cpu-alert1 {
+ temperature = <100000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ cpu_crit: cpu-crit {
+ temperature = <125000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_alert0>;
+ cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
+ };
+ map1 {
+ trip = <&cpu_alert1>;
+ cooling-device = <&fan0 5 THERMAL_NO_LIMIT>;
+ };
+ map2 {
+ trip = <&cpu_alert1>;
+ cooling-device =
+ <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
+ };
+};
+
+In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is
+used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
+device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten
+different cooling states 0-9. It is used to remove the heat out of
+the thermal zone 'cpu-thermal' using its cooling states
+from its minimum to 4, when it reaches trip point 'cpu_alert0'
+at 90C, as an example of active cooling. The same cooling device is used at
+'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also
+linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
+using all its cooling states at trip point 'cpu_alert1',
+which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
+temperature of 125C, represented by the trip point 'cpu_crit', the silicon
+is not reliable anymore.
+
+(b) - IC with several internal sensors
+
+The example below describes how to deploy several thermal zones based off a
+single sensor IC, assuming it has several internal sensors. This is a common
+case on SoC designs with several internal IPs that may need different thermal
+requirements, and thus may have their own sensor to monitor or detect internal
+hotspots in their silicon.
+
+#include <dt-bindings/thermal/thermal.h>
+
+ocp {
+ ...
+ /*
+ * A simple IC with several bandgap temperature sensors.
+ */
+ bandgap0: bandgap@0x0000ED00 {
+ ...
+ #thermal-sensor-cells = <1>;
+ };
+};
+
+thermal-zones {
+ cpu_thermal: cpu-thermal {
+ polling-delay-passive = <250>; /* milliseconds */
+ polling-delay = <1000>; /* milliseconds */
+
+ /* sensor ID */
+ thermal-sensors = <&bandgap0 0>;
+
+ trips {
+ /* each zone within the SoC may have its own trips */
+ cpu_alert: cpu-alert {
+ temperature = <100000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ cpu_crit: cpu-crit {
+ temperature = <125000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ /* each zone within the SoC may have its own cooling */
+ ...
+ };
+ };
+
+ gpu_thermal: gpu-thermal {
+ polling-delay-passive = <120>; /* milliseconds */
+ polling-delay = <1000>; /* milliseconds */
+
+ /* sensor ID */
+ thermal-sensors = <&bandgap0 1>;
+
+ trips {
+ /* each zone within the SoC may have its own trips */
+ gpu_alert: gpu-alert {
+ temperature = <90000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ gpu_crit: gpu-crit {
+ temperature = <105000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ /* each zone within the SoC may have its own cooling */
+ ...
+ };
+ };
+
+ dsp_thermal: dsp-thermal {
+ polling-delay-passive = <50>; /* milliseconds */
+ polling-delay = <1000>; /* milliseconds */
+
+ /* sensor ID */
+ thermal-sensors = <&bandgap0 2>;
+
+ trips {
+ /* each zone within the SoC may have its own trips */
+ dsp_alert: dsp-alert {
+ temperature = <90000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ dsp_crit: gpu-crit {
+ temperature = <135000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ /* each zone within the SoC may have its own cooling */
+ ...
+ };
+ };
+};
+
+In the example above, there is one bandgap IC which has the capability to
+monitor three sensors. The hardware has been designed so that sensors are
+placed on different places in the DIE to monitor different temperature
+hotspots: one for CPU thermal zone, one for GPU thermal zone and the
+other to monitor a DSP thermal zone.
+
+Thus, there is a need to assign each sensor provided by the bandgap IC
+to different thermal zones. This is achieved by means of using the
+#thermal-sensor-cells property and using the first cell of the sensor
+specifier as sensor ID. In the example, then, <bandgap 0> is used to
+monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal
+zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone
+may be uncorrelated, having its own dT/dt requirements, trips
+and cooling maps.
+
+
+(c) - Several sensors within one single thermal zone
+
+The example below illustrates how to use more than one sensor within
+one thermal zone.
+
+#include <dt-bindings/thermal/thermal.h>
+
+&i2c1 {
+ ...
+ /*
+ * A simple IC with a single temperature sensor.
+ */
+ adc: sensor@0x49 {
+ ...
+ #thermal-sensor-cells = <0>;
+ };
+};
+
+ocp {
+ ...
+ /*
+ * A simple IC with a single bandgap temperature sensor.
+ */
+ bandgap0: bandgap@0x0000ED00 {
+ ...
+ #thermal-sensor-cells = <0>;
+ };
+};
+
+thermal-zones {
+ cpu_thermal: cpu-thermal {
+ polling-delay-passive = <250>; /* milliseconds */
+ polling-delay = <1000>; /* milliseconds */
+
+ thermal-sensors = <&bandgap0>, /* cpu */
+ <&adc>; /* pcb north */
+
+ /* hotspot = 100 * bandgap - 120 * adc + 484 */
+ coefficients = <100 -120 484>;
+
+ trips {
+ ...
+ };
+
+ cooling-maps {
+ ...
+ };
+ };
+};
+
+In some cases, there is a need to use more than one sensor to extrapolate
+a thermal hotspot in the silicon. The above example illustrates this situation.
+For instance, it may be the case that a sensor external to CPU IP may be placed
+close to CPU hotspot and together with internal CPU sensor, it is used
+to determine the hotspot. Assuming this is the case for the above example,
+the hypothetical extrapolation rule would be:
+ hotspot = 100 * bandgap - 120 * adc + 484
+
+In other context, the same idea can be used to add fixed offset. For instance,
+consider the hotspot extrapolation rule below:
+ hotspot = 1 * adc + 6000
+
+In the above equation, the hotspot is always 6C higher than what is read
+from the ADC sensor. The binding would be then:
+ thermal-sensors = <&adc>;
+
+ /* hotspot = 1 * adc + 6000 */
+ coefficients = <1 6000>;
+
+(d) - Board thermal
+
+The board thermal example below illustrates how to setup one thermal zone
+with many sensors and many cooling devices.
+
+#include <dt-bindings/thermal/thermal.h>
+
+&i2c1 {
+ ...
+ /*
+ * An IC with several temperature sensor.
+ */
+ adc_dummy: sensor@0x50 {
+ ...
+ #thermal-sensor-cells = <1>; /* sensor internal ID */
+ };
+};
+
+thermal-zones {
+ batt-thermal {
+ polling-delay-passive = <500>; /* milliseconds */
+ polling-delay = <2500>; /* milliseconds */
+
+ /* sensor ID */
+ thermal-sensors = <&adc_dummy 4>;
+
+ trips {
+ ...
+ };
+
+ cooling-maps {
+ ...
+ };
+ };
+
+ board_thermal: board-thermal {
+ polling-delay-passive = <1000>; /* milliseconds */
+ polling-delay = <2500>; /* milliseconds */
+
+ /* sensor ID */
+ thermal-sensors = <&adc_dummy 0>, /* pcb top edge */
+ <&adc_dummy 1>, /* lcd */
+ <&adc_dummy 2>; /* back cover */
+ /*
+ * An array of coefficients describing the sensor
+ * linear relation. E.g.:
+ * z = c1*x1 + c2*x2 + c3*x3
+ */
+ coefficients = <1200 -345 890>;
+
+ trips {
+ /* Trips are based on resulting linear equation */
+ cpu_trip: cpu-trip {
+ temperature = <60000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ gpu_trip: gpu-trip {
+ temperature = <55000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ }
+ lcd_trip: lcp-trip {
+ temperature = <53000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ crit_trip: crit-trip {
+ temperature = <68000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_trip>;
+ cooling-device = <&cpu0 0 2>;
+ contribution = <55>;
+ };
+ map1 {
+ trip = <&gpu_trip>;
+ cooling-device = <&gpu0 0 2>;
+ contribution = <20>;
+ };
+ map2 {
+ trip = <&lcd_trip>;
+ cooling-device = <&lcd0 5 10>;
+ contribution = <15>;
+ };
+ };
+ };
+};
+
+The above example is a mix of previous examples, a sensor IP with several internal
+sensors used to monitor different zones, one of them is composed by several sensors and
+with different cooling devices.
diff --git a/kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
new file mode 100644
index 000000000..0c9222d27
--- /dev/null
+++ b/kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
@@ -0,0 +1,74 @@
+* Texas Instrument OMAP SCM bandgap bindings
+
+In the System Control Module, OMAP supplies a voltage reference
+and a temperature sensor feature that are gathered in the band
+gap voltage and temperature sensor (VBGAPTS) module. The band
+gap provides current and voltage reference for its internal
+circuits and other analog IP blocks. The analog-to-digital
+converter (ADC) produces an output value that is proportional
+to the silicon temperature.
+
+Required properties:
+- compatible : Should be:
+ - "ti,omap4430-bandgap" : for OMAP4430 bandgap
+ - "ti,omap4460-bandgap" : for OMAP4460 bandgap
+ - "ti,omap4470-bandgap" : for OMAP4470 bandgap
+ - "ti,omap5430-bandgap" : for OMAP5430 bandgap
+- interrupts : this entry should indicate which interrupt line
+the talert signal is routed to;
+Specific:
+- gpios : this entry should be used to inform which GPIO
+line the tshut signal is routed to. The informed GPIO will
+be treated as an IRQ;
+- regs : this entry must also be specified and it is specific
+to each bandgap version, because the mapping may change from
+soc to soc, apart of depending on available features.
+
+Example:
+OMAP4430:
+bandgap {
+ reg = <0x4a002260 0x4 0x4a00232C 0x4>;
+ compatible = "ti,omap4430-bandgap";
+};
+
+OMAP4460:
+bandgap {
+ reg = <0x4a002260 0x4
+ 0x4a00232C 0x4
+ 0x4a002378 0x18>;
+ compatible = "ti,omap4460-bandgap";
+ interrupts = <0 126 4>; /* talert */
+ gpios = <&gpio3 22 0>; /* tshut */
+};
+
+OMAP4470:
+bandgap {
+ reg = <0x4a002260 0x4
+ 0x4a00232C 0x4
+ 0x4a002378 0x18>;
+ compatible = "ti,omap4470-bandgap";
+ interrupts = <0 126 4>; /* talert */
+ gpios = <&gpio3 22 0>; /* tshut */
+};
+
+OMAP5430:
+bandgap {
+ reg = <0x4a0021e0 0xc
+ 0x4a00232c 0xc
+ 0x4a002380 0x2c
+ 0x4a0023C0 0x3c>;
+ compatible = "ti,omap5430-bandgap";
+ interrupts = <0 126 4>; /* talert */
+};
+
+DRA752:
+bandgap {
+ reg = <0x4a0021e0 0xc
+ 0x4a00232c 0xc
+ 0x4a002380 0x2c
+ 0x4a0023C0 0x3c
+ 0x4a002564 0x8
+ 0x4a002574 0x50>;
+ compatible = "ti,dra752-bandgap";
+ interrupts = <0 126 4>; /* talert */
+};