diff options
Diffstat (limited to 'kernel/Documentation/devicetree/bindings/thermal')
5 files changed, 129 insertions, 16 deletions
diff --git a/kernel/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt new file mode 100644 index 000000000..d48fc5280 --- /dev/null +++ b/kernel/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt @@ -0,0 +1,23 @@ +* Temperature Sensor on hisilicon SoCs + +** Required properties : + +- compatible: "hisilicon,tsensor". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- interrupt: The interrupt number to the cpu. Defines the interrupt used + by /SOCTHERM/tsensor. +- clock-names: Input clock name, should be 'thermal_clk'. +- clocks: phandles for clock specified in "clock-names" property. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : + + tsensor: tsensor@0,f7030700 { + compatible = "hisilicon,tsensor"; + reg = <0x0 0xf7030700 0x0 0x1000>; + interrupts = <0 7 0x4>; + clocks = <&sys_ctrl HI6220_TSENSOR_CLK>; + clock-names = "thermal_clk"; + #thermal-sensor-cells = <1>; + } diff --git a/kernel/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/kernel/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt new file mode 100644 index 000000000..290ec06fa --- /dev/null +++ b/kernel/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt @@ -0,0 +1,57 @@ +Qualcomm QPNP PMIC Temperature Alarm + +QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips +that utilize the Qualcomm SPMI implementation. These peripherals provide an +interrupt signal and status register to identify high PMIC die temperature. + +Required properties: +- compatible: Should contain "qcom,spmi-temp-alarm". +- reg: Specifies the SPMI address and length of the controller's + registers. +- interrupts: PMIC temperature alarm interrupt. +- #thermal-sensor-cells: Should be 0. See thermal.txt for a description. + +Optional properties: +- io-channels: Should contain IIO channel specifier for the ADC channel, + which report chip die temperature. +- io-channel-names: Should contain "thermal". + +Example: + + pm8941_temp: thermal-alarm@2400 { + compatible = "qcom,spmi-temp-alarm"; + reg = <0x2400 0x100>; + interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <0>; + + io-channels = <&pm8941_vadc VADC_DIE_TEMP>; + io-channel-names = "thermal"; + }; + + thermal-zones { + pm8941 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&pm8941_temp>; + + trips { + passive { + temperature = <1050000>; + hysteresis = <2000>; + type = "passive"; + }; + alert { + temperature = <125000>; + hysteresis = <2000>; + type = "hot"; + }; + crit { + temperature = <145000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + diff --git a/kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt index ef802de49..0dfa60d88 100644 --- a/kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt +++ b/kernel/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt @@ -1,7 +1,9 @@ * Temperature Sensor ADC (TSADC) on rockchip SoCs Required properties: -- compatible : "rockchip,rk3288-tsadc" +- compatible : should be "rockchip,<name>-tsadc" + "rockchip,rk3288-tsadc": found on RK3288 SoCs + "rockchip,rk3368-tsadc": found on RK3368 SoCs - reg : physical base address of the controller and length of memory mapped region. - interrupts : The interrupt number to the cpu. The interrupt specifier format @@ -12,6 +14,11 @@ Required properties: - resets : Must contain an entry for each entry in reset-names. See ../reset/reset.txt for details. - reset-names : Must include the name "tsadc-apb". +- pinctrl-names : The pin control state names; +- pinctrl-0 : The "init" pinctrl state, it will be set before device probe. +- pinctrl-1 : The "default" pinctrl state, it will be set after reset the + TSADC controller. +- pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend. - #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description. - rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value. - rockchip,hw-tshut-mode : The hardware-controlled shutdown mode 0:CRU 1:GPIO. @@ -27,8 +34,10 @@ tsadc: tsadc@ff280000 { clock-names = "tsadc", "apb_pclk"; resets = <&cru SRST_TSADC>; reset-names = "tsadc-apb"; - pinctrl-names = "default"; - pinctrl-0 = <&otp_out>; + pinctrl-names = "init", "default", "sleep"; + pinctrl-0 = <&otp_gpio>; + pinctrl-1 = <&otp_out>; + pinctrl-2 = <&otp_gpio>; #thermal-sensor-cells = <1>; rockchip,hw-tshut-temp = <95000>; rockchip,hw-tshut-mode = <0>; diff --git a/kernel/Documentation/devicetree/bindings/thermal/thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/thermal.txt index 29fe0bfae..41b817f7b 100644 --- a/kernel/Documentation/devicetree/bindings/thermal/thermal.txt +++ b/kernel/Documentation/devicetree/bindings/thermal/thermal.txt @@ -55,19 +55,11 @@ of heat dissipation). For example a fan's cooling states correspond to the different fan speeds possible. Cooling states are referred to by single unsigned integers, where larger numbers mean greater heat dissipation. The precise set of cooling states associated with a device -(as referred to be the cooling-min-state and cooling-max-state +(as referred to by the cooling-min-level and cooling-max-level properties) should be defined in a particular device's binding. For more examples of cooling devices, refer to the example sections below. Required properties: -- cooling-min-state: An integer indicating the smallest - Type: unsigned cooling state accepted. Typically 0. - Size: one cell - -- cooling-max-state: An integer indicating the largest - Type: unsigned cooling state accepted. - Size: one cell - - #cooling-cells: Used to provide cooling device specific information Type: unsigned while referring to it. Must be at least 2, in order Size: one cell to specify minimum and maximum cooling state used @@ -77,6 +69,15 @@ Required properties: See Cooling device maps section below for more details on how consumers refer to cooling devices. +Optional properties: +- cooling-min-level: An integer indicating the smallest + Type: unsigned cooling state accepted. Typically 0. + Size: one cell + +- cooling-max-level: An integer indicating the largest + Type: unsigned cooling state accepted. + Size: one cell + * Trip points The trip node is a node to describe a point in the temperature domain @@ -167,6 +168,13 @@ Optional property: by means of sensor ID. Additional coefficients are interpreted as constant offset. +- sustainable-power: An estimate of the sustainable power (in mW) that the + Type: unsigned thermal zone can dissipate at the desired + Size: one cell control temperature. For reference, the + sustainable power of a 4'' phone is typically + 2000mW, while on a 10'' tablet is around + 4500mW. + Note: The delay properties are bound to the maximum dT/dt (temperature derivative over time) in two situations for a thermal zone: (i) - when passive cooling is activated (polling-delay-passive); and @@ -218,8 +226,8 @@ cpus { 396000 950000 198000 850000 >; - cooling-min-state = <0>; - cooling-max-state = <3>; + cooling-min-level = <0>; + cooling-max-level = <3>; #cooling-cells = <2>; /* min followed by max */ }; ... @@ -233,8 +241,8 @@ cpus { */ fan0: fan@0x48 { ... - cooling-min-state = <0>; - cooling-max-state = <9>; + cooling-min-level = <0>; + cooling-max-level = <9>; #cooling-cells = <2>; /* min followed by max */ }; }; @@ -546,6 +554,8 @@ thermal-zones { */ coefficients = <1200 -345 890>; + sustainable-power = <2500>; + trips { /* Trips are based on resulting linear equation */ cpu_trip: cpu-trip { diff --git a/kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt index 0c9222d27..6299dd8de 100644 --- a/kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt +++ b/kernel/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt @@ -10,6 +10,8 @@ to the silicon temperature. Required properties: - compatible : Should be: + - "ti,omap34xx-bandgap" : for OMAP34xx bandgap + - "ti,omap36xx-bandgap" : for OMAP36xx bandgap - "ti,omap4430-bandgap" : for OMAP4430 bandgap - "ti,omap4460-bandgap" : for OMAP4460 bandgap - "ti,omap4470-bandgap" : for OMAP4470 bandgap @@ -25,6 +27,18 @@ to each bandgap version, because the mapping may change from soc to soc, apart of depending on available features. Example: +OMAP34xx: +bandgap { + reg = <0x48002524 0x4>; + compatible = "ti,omap34xx-bandgap"; +}; + +OMAP36xx: +bandgap { + reg = <0x48002524 0x4>; + compatible = "ti,omap36xx-bandgap"; +}; + OMAP4430: bandgap { reg = <0x4a002260 0x4 0x4a00232C 0x4>; |