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authorJosé Pekkarinen <jose.pekkarinen@nokia.com>2016-04-11 10:41:07 +0300
committerJosé Pekkarinen <jose.pekkarinen@nokia.com>2016-04-13 08:17:18 +0300
commite09b41010ba33a20a87472ee821fa407a5b8da36 (patch)
treed10dc367189862e7ca5c592f033dc3726e1df4e3 /kernel/Documentation/thermal/sysfs-api.txt
parentf93b97fd65072de626c074dbe099a1fff05ce060 (diff)
These changes are the raw update to linux-4.4.6-rt14. Kernel sources
are taken from kernel.org, and rt patch from the rt wiki download page. During the rebasing, the following patch collided: Force tick interrupt and get rid of softirq magic(I70131fb85). Collisions have been removed because its logic was found on the source already. Change-Id: I7f57a4081d9deaa0d9ccfc41a6c8daccdee3b769 Signed-off-by: José Pekkarinen <jose.pekkarinen@nokia.com>
Diffstat (limited to 'kernel/Documentation/thermal/sysfs-api.txt')
-rw-r--r--kernel/Documentation/thermal/sysfs-api.txt105
1 files changed, 100 insertions, 5 deletions
diff --git a/kernel/Documentation/thermal/sysfs-api.txt b/kernel/Documentation/thermal/sysfs-api.txt
index 87519cb37..10f062ea6 100644
--- a/kernel/Documentation/thermal/sysfs-api.txt
+++ b/kernel/Documentation/thermal/sysfs-api.txt
@@ -95,7 +95,7 @@ temperature) and throttle appropriate devices.
1.3 interface for binding a thermal zone device with a thermal cooling device
1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev,
- unsigned long upper, unsigned long lower);
+ unsigned long upper, unsigned long lower, unsigned int weight);
This interface function bind a thermal cooling device to the certain trip
point of a thermal zone device.
@@ -110,6 +110,8 @@ temperature) and throttle appropriate devices.
lower:the Minimum cooling state can be used for this trip point.
THERMAL_NO_LIMIT means no lower limit,
and the cooling device can be in cooling state 0.
+ weight: the influence of this cooling device in this thermal
+ zone. See 1.4.1 below for more information.
1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev);
@@ -127,9 +129,15 @@ temperature) and throttle appropriate devices.
This structure defines the following parameters that are used to bind
a zone with a cooling device for a particular trip point.
.cdev: The cooling device pointer
- .weight: The 'influence' of a particular cooling device on this zone.
- This is on a percentage scale. The sum of all these weights
- (for a particular zone) cannot exceed 100.
+ .weight: The 'influence' of a particular cooling device on this
+ zone. This is relative to the rest of the cooling
+ devices. For example, if all cooling devices have a
+ weight of 1, then they all contribute the same. You can
+ use percentages if you want, but it's not mandatory. A
+ weight of 0 means that this cooling device doesn't
+ contribute to the cooling of this zone unless all cooling
+ devices have a weight of 0. If all weights are 0, then
+ they all contribute the same.
.trip_mask:This is a bit mask that gives the binding relation between
this thermal zone and cdev, for a particular trip point.
If nth bit is set, then the cdev and thermal zone are bound
@@ -172,10 +180,19 @@ Thermal zone device sys I/F, created once it's registered:
|---temp: Current temperature
|---mode: Working mode of the thermal zone
|---policy: Thermal governor used for this zone
+ |---available_policies: Available thermal governors for this zone
|---trip_point_[0-*]_temp: Trip point temperature
|---trip_point_[0-*]_type: Trip point type
|---trip_point_[0-*]_hyst: Hysteresis value for this trip point
|---emul_temp: Emulated temperature set node
+ |---sustainable_power: Sustainable dissipatable power
+ |---k_po: Proportional term during temperature overshoot
+ |---k_pu: Proportional term during temperature undershoot
+ |---k_i: PID's integral term in the power allocator gov
+ |---k_d: PID's derivative term in the power allocator
+ |---integral_cutoff: Offset above which errors are accumulated
+ |---slope: Slope constant applied as linear extrapolation
+ |---offset: Offset constant applied as linear extrapolation
Thermal cooling device sys I/F, created once it's registered:
/sys/class/thermal/cooling_device[0-*]:
@@ -192,6 +209,8 @@ thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
/sys/class/thermal/thermal_zone[0-*]:
|---cdev[0-*]: [0-*]th cooling device in current thermal zone
|---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
+ |---cdev[0-*]_weight: Influence of the cooling device in
+ this thermal zone
Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
the generic thermal driver also creates a hwmon sysfs I/F for each _type_
@@ -238,6 +257,10 @@ policy
One of the various thermal governors used for a particular zone.
RW, Required
+available_policies
+ Available thermal governors which can be used for a particular zone.
+ RO, Required
+
trip_point_[0-*]_temp
The temperature above which trip point will be fired.
Unit: millidegree Celsius
@@ -265,6 +288,14 @@ cdev[0-*]_trip_point
point.
RO, Optional
+cdev[0-*]_weight
+ The influence of cdev[0-*] in this thermal zone. This value
+ is relative to the rest of cooling devices in the thermal
+ zone. For example, if a cooling device has a weight double
+ than that of other, it's twice as effective in cooling the
+ thermal zone.
+ RW, Optional
+
passive
Attribute is only present for zones in which the passive cooling
policy is not supported by native thermal driver. Default is zero
@@ -289,6 +320,66 @@ emul_temp
because userland can easily disable the thermal policy by simply
flooding this sysfs node with low temperature values.
+sustainable_power
+ An estimate of the sustained power that can be dissipated by
+ the thermal zone. Used by the power allocator governor. For
+ more information see Documentation/thermal/power_allocator.txt
+ Unit: milliwatts
+ RW, Optional
+
+k_po
+ The proportional term of the power allocator governor's PID
+ controller during temperature overshoot. Temperature overshoot
+ is when the current temperature is above the "desired
+ temperature" trip point. For more information see
+ Documentation/thermal/power_allocator.txt
+ RW, Optional
+
+k_pu
+ The proportional term of the power allocator governor's PID
+ controller during temperature undershoot. Temperature undershoot
+ is when the current temperature is below the "desired
+ temperature" trip point. For more information see
+ Documentation/thermal/power_allocator.txt
+ RW, Optional
+
+k_i
+ The integral term of the power allocator governor's PID
+ controller. This term allows the PID controller to compensate
+ for long term drift. For more information see
+ Documentation/thermal/power_allocator.txt
+ RW, Optional
+
+k_d
+ The derivative term of the power allocator governor's PID
+ controller. For more information see
+ Documentation/thermal/power_allocator.txt
+ RW, Optional
+
+integral_cutoff
+ Temperature offset from the desired temperature trip point
+ above which the integral term of the power allocator
+ governor's PID controller starts accumulating errors. For
+ example, if integral_cutoff is 0, then the integral term only
+ accumulates error when temperature is above the desired
+ temperature trip point. For more information see
+ Documentation/thermal/power_allocator.txt
+ RW, Optional
+
+slope
+ The slope constant used in a linear extrapolation model
+ to determine a hotspot temperature based off the sensor's
+ raw readings. It is up to the device driver to determine
+ the usage of these values.
+ RW, Optional
+
+offset
+ The offset constant used in a linear extrapolation model
+ to determine a hotspot temperature based off the sensor's
+ raw readings. It is up to the device driver to determine
+ the usage of these values.
+ RW, Optional
+
*****************************
* Cooling device attributes *
*****************************
@@ -318,7 +409,8 @@ passive, active. If an ACPI thermal zone supports critical, passive,
active[0] and active[1] at the same time, it may register itself as a
thermal_zone_device (thermal_zone1) with 4 trip points in all.
It has one processor and one fan, which are both registered as
-thermal_cooling_device.
+thermal_cooling_device. Both are considered to have the same
+effectiveness in cooling the thermal zone.
If the processor is listed in _PSL method, and the fan is listed in _AL0
method, the sys I/F structure will be built like this:
@@ -330,6 +422,7 @@ method, the sys I/F structure will be built like this:
|---temp: 37000
|---mode: enabled
|---policy: step_wise
+ |---available_policies: step_wise fair_share
|---trip_point_0_temp: 100000
|---trip_point_0_type: critical
|---trip_point_1_temp: 80000
@@ -340,8 +433,10 @@ method, the sys I/F structure will be built like this:
|---trip_point_3_type: active1
|---cdev0: --->/sys/class/thermal/cooling_device0
|---cdev0_trip_point: 1 /* cdev0 can be used for passive */
+ |---cdev0_weight: 1024
|---cdev1: --->/sys/class/thermal/cooling_device3
|---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
+ |---cdev1_weight: 1024
|cooling_device0:
|---type: Processor