From 9ca8dbcc65cfc63d6f5ef3312a33184e1d726e00 Mon Sep 17 00:00:00 2001 From: Yunhong Jiang Date: Tue, 4 Aug 2015 12:17:53 -0700 Subject: Add the rt linux 4.1.3-rt3 as base Import the rt linux 4.1.3-rt3 as OPNFV kvm base. It's from git://git.kernel.org/pub/scm/linux/kernel/git/rt/linux-rt-devel.git linux-4.1.y-rt and the base is: commit 0917f823c59692d751951bf5ea699a2d1e2f26a2 Author: Sebastian Andrzej Siewior Date: Sat Jul 25 12:13:34 2015 +0200 Prepare v4.1.3-rt3 Signed-off-by: Sebastian Andrzej Siewior We lose all the git history this way and it's not good. We should apply another opnfv project repo in future. Change-Id: I87543d81c9df70d99c5001fbdf646b202c19f423 Signed-off-by: Yunhong Jiang --- kernel/Documentation/thermal/cpu-cooling-api.txt | 43 +++ kernel/Documentation/thermal/exynos_thermal | 77 ++++ .../Documentation/thermal/exynos_thermal_emulation | 53 +++ kernel/Documentation/thermal/intel_powerclamp.txt | 307 ++++++++++++++++ kernel/Documentation/thermal/nouveau_thermal | 82 +++++ kernel/Documentation/thermal/sysfs-api.txt | 401 +++++++++++++++++++++ .../thermal/x86_pkg_temperature_thermal | 47 +++ 7 files changed, 1010 insertions(+) create mode 100644 kernel/Documentation/thermal/cpu-cooling-api.txt create mode 100644 kernel/Documentation/thermal/exynos_thermal create mode 100644 kernel/Documentation/thermal/exynos_thermal_emulation create mode 100644 kernel/Documentation/thermal/intel_powerclamp.txt create mode 100644 kernel/Documentation/thermal/nouveau_thermal create mode 100644 kernel/Documentation/thermal/sysfs-api.txt create mode 100644 kernel/Documentation/thermal/x86_pkg_temperature_thermal (limited to 'kernel/Documentation/thermal') diff --git a/kernel/Documentation/thermal/cpu-cooling-api.txt b/kernel/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000000000..753e47cc2 --- /dev/null +++ b/kernel/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,43 @@ +CPU cooling APIs How To +=================================== + +Written by Amit Daniel Kachhap + +Updated: 6 Jan 2015 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + + This interface function registers the cpufreq cooling device with the name + "thermal-cpufreq-%x". This api can support multiple instances of cpufreq + cooling devices. + + clip_cpus: cpumask of cpus where the frequency constraints will happen. + +1.1.2 struct thermal_cooling_device *of_cpufreq_cooling_register( + struct device_node *np, const struct cpumask *clip_cpus) + + This interface function registers the cpufreq cooling device with + the name "thermal-cpufreq-%x" linking it with a device tree node, in + order to bind it via the thermal DT code. This api can support multiple + instances of cpufreq cooling devices. + + np: pointer to the cooling device device tree node + clip_cpus: cpumask of cpus where the frequency constraints will happen. + +1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) + + This interface function unregisters the "thermal-cpufreq-%x" cooling device. + + cdev: Cooling device pointer which has to be unregistered. diff --git a/kernel/Documentation/thermal/exynos_thermal b/kernel/Documentation/thermal/exynos_thermal new file mode 100644 index 000000000..9010c4416 --- /dev/null +++ b/kernel/Documentation/thermal/exynos_thermal @@ -0,0 +1,77 @@ +Kernel driver exynos_tmu +================= + +Supported chips: +* ARM SAMSUNG EXYNOS4, EXYNOS5 series of SoC + Datasheet: Not publicly available + +Authors: Donggeun Kim +Authors: Amit Daniel + +TMU controller Description: +--------------------------- + +This driver allows to read temperature inside SAMSUNG EXYNOS4/5 series of SoC. + +The chip only exposes the measured 8-bit temperature code value +through a register. +Temperature can be taken from the temperature code. +There are three equations converting from temperature to temperature code. + +The three equations are: + 1. Two point trimming + Tc = (T - 25) * (TI2 - TI1) / (85 - 25) + TI1 + + 2. One point trimming + Tc = T + TI1 - 25 + + 3. No trimming + Tc = T + 50 + + Tc: Temperature code, T: Temperature, + TI1: Trimming info for 25 degree Celsius (stored at TRIMINFO register) + Temperature code measured at 25 degree Celsius which is unchanged + TI2: Trimming info for 85 degree Celsius (stored at TRIMINFO register) + Temperature code measured at 85 degree Celsius which is unchanged + +TMU(Thermal Management Unit) in EXYNOS4/5 generates interrupt +when temperature exceeds pre-defined levels. +The maximum number of configurable threshold is five. +The threshold levels are defined as follows: + Level_0: current temperature > trigger_level_0 + threshold + Level_1: current temperature > trigger_level_1 + threshold + Level_2: current temperature > trigger_level_2 + threshold + Level_3: current temperature > trigger_level_3 + threshold + + The threshold and each trigger_level are set + through the corresponding registers. + +When an interrupt occurs, this driver notify kernel thermal framework +with the function exynos_report_trigger. +Although an interrupt condition for level_0 can be set, +it can be used to synchronize the cooling action. + +TMU driver description: +----------------------- + +The exynos thermal driver is structured as, + + Kernel Core thermal framework + (thermal_core.c, step_wise.c, cpu_cooling.c) + ^ + | + | +TMU configuration data -------> TMU Driver <------> Exynos Core thermal wrapper +(exynos_tmu_data.c) (exynos_tmu.c) (exynos_thermal_common.c) +(exynos_tmu_data.h) (exynos_tmu.h) (exynos_thermal_common.h) + +a) TMU configuration data: This consist of TMU register offsets/bitfields + described through structure exynos_tmu_registers. Also several + other platform data (struct exynos_tmu_platform_data) members + are used to configure the TMU. +b) TMU driver: This component initialises the TMU controller and sets different + thresholds. It invokes core thermal implementation with the call + exynos_report_trigger. +c) Exynos Core thermal wrapper: This provides 3 wrapper function to use the + Kernel core thermal framework. They are exynos_unregister_thermal, + exynos_register_thermal and exynos_report_trigger. diff --git a/kernel/Documentation/thermal/exynos_thermal_emulation b/kernel/Documentation/thermal/exynos_thermal_emulation new file mode 100644 index 000000000..b15efec6c --- /dev/null +++ b/kernel/Documentation/thermal/exynos_thermal_emulation @@ -0,0 +1,53 @@ +EXYNOS EMULATION MODE +======================== + +Copyright (C) 2012 Samsung Electronics + +Written by Jonghwa Lee + +Description +----------- + +Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal management unit. +Thermal emulation mode supports software debug for TMU's operation. User can set temperature +manually with software code and TMU will read current temperature from user value not from +sensor's value. + +Enabling CONFIG_THERMAL_EMULATION option will make this support available. +When it's enabled, sysfs node will be created as +/sys/devices/virtual/thermal/thermal_zone'zone id'/emul_temp. + +The sysfs node, 'emul_node', will contain value 0 for the initial state. When you input any +temperature you want to update to sysfs node, it automatically enable emulation mode and +current temperature will be changed into it. +(Exynos also supports user changeable delay time which would be used to delay of + changing temperature. However, this node only uses same delay of real sensing time, 938us.) + +Exynos emulation mode requires synchronous of value changing and enabling. It means when you +want to update the any value of delay or next temperature, then you have to enable emulation +mode at the same time. (Or you have to keep the mode enabling.) If you don't, it fails to +change the value to updated one and just use last succeessful value repeatedly. That's why +this node gives users the right to change termerpature only. Just one interface makes it more +simply to use. + +Disabling emulation mode only requires writing value 0 to sysfs node. + + +TEMP 120 | + | + 100 | + | + 80 | + | +----------- + 60 | | | + | +-------------| | + 40 | | | | + | | | | + 20 | | | +---------- + | | | | | + 0 |______________|_____________|__________|__________|_________ + A A A A TIME + |<----->| |<----->| |<----->| | + | 938us | | | | | | +emulation : 0 50 | 70 | 20 | 0 +current temp : sensor 50 70 20 sensor diff --git a/kernel/Documentation/thermal/intel_powerclamp.txt b/kernel/Documentation/thermal/intel_powerclamp.txt new file mode 100644 index 000000000..332de4a39 --- /dev/null +++ b/kernel/Documentation/thermal/intel_powerclamp.txt @@ -0,0 +1,307 @@ + ======================= + INTEL POWERCLAMP DRIVER + ======================= +By: Arjan van de Ven + Jacob Pan + +Contents: + (*) Introduction + - Goals and Objectives + + (*) Theory of Operation + - Idle Injection + - Calibration + + (*) Performance Analysis + - Effectiveness and Limitations + - Power vs Performance + - Scalability + - Calibration + - Comparison with Alternative Techniques + + (*) Usage and Interfaces + - Generic Thermal Layer (sysfs) + - Kernel APIs (TBD) + +============ +INTRODUCTION +============ + +Consider the situation where a system’s power consumption must be +reduced at runtime, due to power budget, thermal constraint, or noise +level, and where active cooling is not preferred. Software managed +passive power reduction must be performed to prevent the hardware +actions that are designed for catastrophic scenarios. + +Currently, P-states, T-states (clock modulation), and CPU offlining +are used for CPU throttling. + +On Intel CPUs, C-states provide effective power reduction, but so far +they’re only used opportunistically, based on workload. With the +development of intel_powerclamp driver, the method of synchronizing +idle injection across all online CPU threads was introduced. The goal +is to achieve forced and controllable C-state residency. + +Test/Analysis has been made in the areas of power, performance, +scalability, and user experience. In many cases, clear advantage is +shown over taking the CPU offline or modulating the CPU clock. + + +=================== +THEORY OF OPERATION +=================== + +Idle Injection +-------------- + +On modern Intel processors (Nehalem or later), package level C-state +residency is available in MSRs, thus also available to the kernel. + +These MSRs are: + #define MSR_PKG_C2_RESIDENCY 0x60D + #define MSR_PKG_C3_RESIDENCY 0x3F8 + #define MSR_PKG_C6_RESIDENCY 0x3F9 + #define MSR_PKG_C7_RESIDENCY 0x3FA + +If the kernel can also inject idle time to the system, then a +closed-loop control system can be established that manages package +level C-state. The intel_powerclamp driver is conceived as such a +control system, where the target set point is a user-selected idle +ratio (based on power reduction), and the error is the difference +between the actual package level C-state residency ratio and the target idle +ratio. + +Injection is controlled by high priority kernel threads, spawned for +each online CPU. + +These kernel threads, with SCHED_FIFO class, are created to perform +clamping actions of controlled duty ratio and duration. Each per-CPU +thread synchronizes its idle time and duration, based on the rounding +of jiffies, so accumulated errors can be prevented to avoid a jittery +effect. Threads are also bound to the CPU such that they cannot be +migrated, unless the CPU is taken offline. In this case, threads +belong to the offlined CPUs will be terminated immediately. + +Running as SCHED_FIFO and relatively high priority, also allows such +scheme to work for both preemptable and non-preemptable kernels. +Alignment of idle time around jiffies ensures scalability for HZ +values. This effect can be better visualized using a Perf timechart. +The following diagram shows the behavior of kernel thread +kidle_inject/cpu. During idle injection, it runs monitor/mwait idle +for a given "duration", then relinquishes the CPU to other tasks, +until the next time interval. + +The NOHZ schedule tick is disabled during idle time, but interrupts +are not masked. Tests show that the extra wakeups from scheduler tick +have a dramatic impact on the effectiveness of the powerclamp driver +on large scale systems (Westmere system with 80 processors). + +CPU0 + ____________ ____________ +kidle_inject/0 | sleep | mwait | sleep | + _________| |________| |_______ + duration +CPU1 + ____________ ____________ +kidle_inject/1 | sleep | mwait | sleep | + _________| |________| |_______ + ^ + | + | + roundup(jiffies, interval) + +Only one CPU is allowed to collect statistics and update global +control parameters. This CPU is referred to as the controlling CPU in +this document. The controlling CPU is elected at runtime, with a +policy that favors BSP, taking into account the possibility of a CPU +hot-plug. + +In terms of dynamics of the idle control system, package level idle +time is considered largely as a non-causal system where its behavior +cannot be based on the past or current input. Therefore, the +intel_powerclamp driver attempts to enforce the desired idle time +instantly as given input (target idle ratio). After injection, +powerclamp moniors the actual idle for a given time window and adjust +the next injection accordingly to avoid over/under correction. + +When used in a causal control system, such as a temperature control, +it is up to the user of this driver to implement algorithms where +past samples and outputs are included in the feedback. For example, a +PID-based thermal controller can use the powerclamp driver to +maintain a desired target temperature, based on integral and +derivative gains of the past samples. + + + +Calibration +----------- +During scalability testing, it is observed that synchronized actions +among CPUs become challenging as the number of cores grows. This is +also true for the ability of a system to enter package level C-states. + +To make sure the intel_powerclamp driver scales well, online +calibration is implemented. The goals for doing such a calibration +are: + +a) determine the effective range of idle injection ratio +b) determine the amount of compensation needed at each target ratio + +Compensation to each target ratio consists of two parts: + + a) steady state error compensation + This is to offset the error occurring when the system can + enter idle without extra wakeups (such as external interrupts). + + b) dynamic error compensation + When an excessive amount of wakeups occurs during idle, an + additional idle ratio can be added to quiet interrupts, by + slowing down CPU activities. + +A debugfs file is provided for the user to examine compensation +progress and results, such as on a Westmere system. +[jacob@nex01 ~]$ cat +/sys/kernel/debug/intel_powerclamp/powerclamp_calib +controlling cpu: 0 +pct confidence steady dynamic (compensation) +0 0 0 0 +1 1 0 0 +2 1 1 0 +3 3 1 0 +4 3 1 0 +5 3 1 0 +6 3 1 0 +7 3 1 0 +8 3 1 0 +... +30 3 2 0 +31 3 2 0 +32 3 1 0 +33 3 2 0 +34 3 1 0 +35 3 2 0 +36 3 1 0 +37 3 2 0 +38 3 1 0 +39 3 2 0 +40 3 3 0 +41 3 1 0 +42 3 2 0 +43 3 1 0 +44 3 1 0 +45 3 2 0 +46 3 3 0 +47 3 0 0 +48 3 2 0 +49 3 3 0 + +Calibration occurs during runtime. No offline method is available. +Steady state compensation is used only when confidence levels of all +adjacent ratios have reached satisfactory level. A confidence level +is accumulated based on clean data collected at runtime. Data +collected during a period without extra interrupts is considered +clean. + +To compensate for excessive amounts of wakeup during idle, additional +idle time is injected when such a condition is detected. Currently, +we have a simple algorithm to double the injection ratio. A possible +enhancement might be to throttle the offending IRQ, such as delaying +EOI for level triggered interrupts. But it is a challenge to be +non-intrusive to the scheduler or the IRQ core code. + + +CPU Online/Offline +------------------ +Per-CPU kernel threads are started/stopped upon receiving +notifications of CPU hotplug activities. The intel_powerclamp driver +keeps track of clamping kernel threads, even after they are migrated +to other CPUs, after a CPU offline event. + + +===================== +Performance Analysis +===================== +This section describes the general performance data collected on +multiple systems, including Westmere (80P) and Ivy Bridge (4P, 8P). + +Effectiveness and Limitations +----------------------------- +The maximum range that idle injection is allowed is capped at 50 +percent. As mentioned earlier, since interrupts are allowed during +forced idle time, excessive interrupts could result in less +effectiveness. The extreme case would be doing a ping -f to generated +flooded network interrupts without much CPU acknowledgement. In this +case, little can be done from the idle injection threads. In most +normal cases, such as scp a large file, applications can be throttled +by the powerclamp driver, since slowing down the CPU also slows down +network protocol processing, which in turn reduces interrupts. + +When control parameters change at runtime by the controlling CPU, it +may take an additional period for the rest of the CPUs to catch up +with the changes. During this time, idle injection is out of sync, +thus not able to enter package C- states at the expected ratio. But +this effect is minor, in that in most cases change to the target +ratio is updated much less frequently than the idle injection +frequency. + +Scalability +----------- +Tests also show a minor, but measurable, difference between the 4P/8P +Ivy Bridge system and the 80P Westmere server under 50% idle ratio. +More compensation is needed on Westmere for the same amount of +target idle ratio. The compensation also increases as the idle ratio +gets larger. The above reason constitutes the need for the +calibration code. + +On the IVB 8P system, compared to an offline CPU, powerclamp can +achieve up to 40% better performance per watt. (measured by a spin +counter summed over per CPU counting threads spawned for all running +CPUs). + +==================== +Usage and Interfaces +==================== +The powerclamp driver is registered to the generic thermal layer as a +cooling device. Currently, it’s not bound to any thermal zones. + +jacob@chromoly:/sys/class/thermal/cooling_device14$ grep . * +cur_state:0 +max_state:50 +type:intel_powerclamp + +Example usage: +- To inject 25% idle time +$ sudo sh -c "echo 25 > /sys/class/thermal/cooling_device80/cur_state +" + +If the system is not busy and has more than 25% idle time already, +then the powerclamp driver will not start idle injection. Using Top +will not show idle injection kernel threads. + +If the system is busy (spin test below) and has less than 25% natural +idle time, powerclamp kernel threads will do idle injection, which +appear running to the scheduler. But the overall system idle is still +reflected. In this example, 24.1% idle is shown. This helps the +system admin or user determine the cause of slowdown, when a +powerclamp driver is in action. + + +Tasks: 197 total, 1 running, 196 sleeping, 0 stopped, 0 zombie +Cpu(s): 71.2%us, 4.7%sy, 0.0%ni, 24.1%id, 0.0%wa, 0.0%hi, 0.0%si, 0.0%st +Mem: 3943228k total, 1689632k used, 2253596k free, 74960k buffers +Swap: 4087804k total, 0k used, 4087804k free, 945336k cached + + PID USER PR NI VIRT RES SHR S %CPU %MEM TIME+ COMMAND + 3352 jacob 20 0 262m 644 428 S 286 0.0 0:17.16 spin + 3341 root -51 0 0 0 0 D 25 0.0 0:01.62 kidle_inject/0 + 3344 root -51 0 0 0 0 D 25 0.0 0:01.60 kidle_inject/3 + 3342 root -51 0 0 0 0 D 25 0.0 0:01.61 kidle_inject/1 + 3343 root -51 0 0 0 0 D 25 0.0 0:01.60 kidle_inject/2 + 2935 jacob 20 0 696m 125m 35m S 5 3.3 0:31.11 firefox + 1546 root 20 0 158m 20m 6640 S 3 0.5 0:26.97 Xorg + 2100 jacob 20 0 1223m 88m 30m S 3 2.3 0:23.68 compiz + +Tests have shown that by using the powerclamp driver as a cooling +device, a PID based userspace thermal controller can manage to +control CPU temperature effectively, when no other thermal influence +is added. For example, a UltraBook user can compile the kernel under +certain temperature (below most active trip points). diff --git a/kernel/Documentation/thermal/nouveau_thermal b/kernel/Documentation/thermal/nouveau_thermal new file mode 100644 index 000000000..60bc29357 --- /dev/null +++ b/kernel/Documentation/thermal/nouveau_thermal @@ -0,0 +1,82 @@ +Kernel driver nouveau +=================== + +Supported chips: +* NV43+ + +Authors: Martin Peres (mupuf) + +Description +--------- + +This driver allows to read the GPU core temperature, drive the GPU fan and +set temperature alarms. + +Currently, due to the absence of in-kernel API to access HWMON drivers, Nouveau +cannot access any of the i2c external monitoring chips it may find. If you +have one of those, temperature and/or fan management through Nouveau's HWMON +interface is likely not to work. This document may then not cover your situation +entirely. + +Temperature management +-------------------- + +Temperature is exposed under as a read-only HWMON attribute temp1_input. + +In order to protect the GPU from overheating, Nouveau supports 4 configurable +temperature thresholds: + + * Fan_boost: Fan speed is set to 100% when reaching this temperature; + * Downclock: The GPU will be downclocked to reduce its power dissipation; + * Critical: The GPU is put on hold to further lower power dissipation; + * Shutdown: Shut the computer down to protect your GPU. + +WARNING: Some of these thresholds may not be used by Nouveau depending +on your chipset. + +The default value for these thresholds comes from the GPU's vbios. These +thresholds can be configured thanks to the following HWMON attributes: + + * Fan_boost: temp1_auto_point1_temp and temp1_auto_point1_temp_hyst; + * Downclock: temp1_max and temp1_max_hyst; + * Critical: temp1_crit and temp1_crit_hyst; + * Shutdown: temp1_emergency and temp1_emergency_hyst. + +NOTE: Remember that the values are stored as milli degrees Celcius. Don't forget +to multiply! + +Fan management +------------ + +Not all cards have a drivable fan. If you do, then the following HWMON +attributes should be available: + + * pwm1_enable: Current fan management mode (NONE, MANUAL or AUTO); + * pwm1: Current PWM value (power percentage); + * pwm1_min: The minimum PWM speed allowed; + * pwm1_max: The maximum PWM speed allowed (bypassed when hitting Fan_boost); + +You may also have the following attribute: + + * fan1_input: Speed in RPM of your fan. + +Your fan can be driven in different modes: + + * 0: The fan is left untouched; + * 1: The fan can be driven in manual (use pwm1 to change the speed); + * 2; The fan is driven automatically depending on the temperature. + +NOTE: Be sure to use the manual mode if you want to drive the fan speed manually + +NOTE2: When operating in manual mode outside the vbios-defined +[PWM_min, PWM_max] range, the reported fan speed (RPM) may not be accurate +depending on your hardware. + +Bug reports +--------- + +Thermal management on Nouveau is new and may not work on all cards. If you have +inquiries, please ping mupuf on IRC (#nouveau, freenode). + +Bug reports should be filled on Freedesktop's bug tracker. Please follow +http://nouveau.freedesktop.org/wiki/Bugs diff --git a/kernel/Documentation/thermal/sysfs-api.txt b/kernel/Documentation/thermal/sysfs-api.txt new file mode 100644 index 000000000..87519cb37 --- /dev/null +++ b/kernel/Documentation/thermal/sysfs-api.txt @@ -0,0 +1,401 @@ +Generic Thermal Sysfs driver How To +=================================== + +Written by Sujith Thomas , Zhang Rui + +Updated: 2 January 2008 + +Copyright (c) 2008 Intel Corporation + + +0. Introduction + +The generic thermal sysfs provides a set of interfaces for thermal zone +devices (sensors) and thermal cooling devices (fan, processor...) to register +with the thermal management solution and to be a part of it. + +This how-to focuses on enabling new thermal zone and cooling devices to +participate in thermal management. +This solution is platform independent and any type of thermal zone devices +and cooling devices should be able to make use of the infrastructure. + +The main task of the thermal sysfs driver is to expose thermal zone attributes +as well as cooling device attributes to the user space. +An intelligent thermal management application can make decisions based on +inputs from thermal zone attributes (the current temperature and trip point +temperature) and throttle appropriate devices. + +[0-*] denotes any positive number starting from 0 +[1-*] denotes any positive number starting from 1 + +1. thermal sysfs driver interface functions + +1.1 thermal zone device interface +1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *type, + int trips, int mask, void *devdata, + struct thermal_zone_device_ops *ops, + const struct thermal_zone_params *tzp, + int passive_delay, int polling_delay)) + + This interface function adds a new thermal zone device (sensor) to + /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the + thermal cooling devices registered at the same time. + + type: the thermal zone type. + trips: the total number of trip points this thermal zone supports. + mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable. + devdata: device private data + ops: thermal zone device call-backs. + .bind: bind the thermal zone device with a thermal cooling device. + .unbind: unbind the thermal zone device with a thermal cooling device. + .get_temp: get the current temperature of the thermal zone. + .get_mode: get the current mode (enabled/disabled) of the thermal zone. + - "enabled" means the kernel thermal management is enabled. + - "disabled" will prevent kernel thermal driver action upon trip points + so that user applications can take charge of thermal management. + .set_mode: set the mode (enabled/disabled) of the thermal zone. + .get_trip_type: get the type of certain trip point. + .get_trip_temp: get the temperature above which the certain trip point + will be fired. + .set_emul_temp: set the emulation temperature which helps in debugging + different threshold temperature points. + tzp: thermal zone platform parameters. + passive_delay: number of milliseconds to wait between polls when + performing passive cooling. + polling_delay: number of milliseconds to wait between polls when checking + whether trip points have been crossed (0 for interrupt driven systems). + + +1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) + + This interface function removes the thermal zone device. + It deletes the corresponding entry form /sys/class/thermal folder and + unbind all the thermal cooling devices it uses. + +1.2 thermal cooling device interface +1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, + void *devdata, struct thermal_cooling_device_ops *) + + This interface function adds a new thermal cooling device (fan/processor/...) + to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself + to all the thermal zone devices register at the same time. + name: the cooling device name. + devdata: device private data. + ops: thermal cooling devices call-backs. + .get_max_state: get the Maximum throttle state of the cooling device. + .get_cur_state: get the Current throttle state of the cooling device. + .set_cur_state: set the Current throttle state of the cooling device. + +1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) + + This interface function remove the thermal cooling device. + It deletes the corresponding entry form /sys/class/thermal folder and + unbind itself from all the thermal zone devices using it. + +1.3 interface for binding a thermal zone device with a thermal cooling device +1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, + int trip, struct thermal_cooling_device *cdev, + unsigned long upper, unsigned long lower); + + This interface function bind a thermal cooling device to the certain trip + point of a thermal zone device. + This function is usually called in the thermal zone device .bind callback. + tz: the thermal zone device + cdev: thermal cooling device + trip: indicates which trip point the cooling devices is associated with + in this thermal zone. + upper:the Maximum cooling state for this trip point. + THERMAL_NO_LIMIT means no upper limit, + and the cooling device can be in max_state. + lower:the Minimum cooling state can be used for this trip point. + THERMAL_NO_LIMIT means no lower limit, + and the cooling device can be in cooling state 0. + +1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, + int trip, struct thermal_cooling_device *cdev); + + This interface function unbind a thermal cooling device from the certain + trip point of a thermal zone device. This function is usually called in + the thermal zone device .unbind callback. + tz: the thermal zone device + cdev: thermal cooling device + trip: indicates which trip point the cooling devices is associated with + in this thermal zone. + +1.4 Thermal Zone Parameters +1.4.1 struct thermal_bind_params + This structure defines the following parameters that are used to bind + a zone with a cooling device for a particular trip point. + .cdev: The cooling device pointer + .weight: The 'influence' of a particular cooling device on this zone. + This is on a percentage scale. The sum of all these weights + (for a particular zone) cannot exceed 100. + .trip_mask:This is a bit mask that gives the binding relation between + this thermal zone and cdev, for a particular trip point. + If nth bit is set, then the cdev and thermal zone are bound + for trip point n. + .limits: This is an array of cooling state limits. Must have exactly + 2 * thermal_zone.number_of_trip_points. It is an array consisting + of tuples of state limits. Each trip + will be associated with one state limit tuple when binding. + A NULL pointer means + on all trips. These limits are used when binding a cdev to a + trip point. + .match: This call back returns success(0) if the 'tz and cdev' need to + be bound, as per platform data. +1.4.2 struct thermal_zone_params + This structure defines the platform level parameters for a thermal zone. + This data, for each thermal zone should come from the platform layer. + This is an optional feature where some platforms can choose not to + provide this data. + .governor_name: Name of the thermal governor used for this zone + .no_hwmon: a boolean to indicate if the thermal to hwmon sysfs interface + is required. when no_hwmon == false, a hwmon sysfs interface + will be created. when no_hwmon == true, nothing will be done. + In case the thermal_zone_params is NULL, the hwmon interface + will be created (for backward compatibility). + .num_tbps: Number of thermal_bind_params entries for this zone + .tbp: thermal_bind_params entries + +2. sysfs attributes structure + +RO read only value +RW read/write value + +Thermal sysfs attributes will be represented under /sys/class/thermal. +Hwmon sysfs I/F extension is also available under /sys/class/hwmon +if hwmon is compiled in or built as a module. + +Thermal zone device sys I/F, created once it's registered: +/sys/class/thermal/thermal_zone[0-*]: + |---type: Type of the thermal zone + |---temp: Current temperature + |---mode: Working mode of the thermal zone + |---policy: Thermal governor used for this zone + |---trip_point_[0-*]_temp: Trip point temperature + |---trip_point_[0-*]_type: Trip point type + |---trip_point_[0-*]_hyst: Hysteresis value for this trip point + |---emul_temp: Emulated temperature set node + +Thermal cooling device sys I/F, created once it's registered: +/sys/class/thermal/cooling_device[0-*]: + |---type: Type of the cooling device(processor/fan/...) + |---max_state: Maximum cooling state of the cooling device + |---cur_state: Current cooling state of the cooling device + + +Then next two dynamic attributes are created/removed in pairs. They represent +the relationship between a thermal zone and its associated cooling device. +They are created/removed for each successful execution of +thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. + +/sys/class/thermal/thermal_zone[0-*]: + |---cdev[0-*]: [0-*]th cooling device in current thermal zone + |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with + +Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, +the generic thermal driver also creates a hwmon sysfs I/F for each _type_ +of thermal zone device. E.g. the generic thermal driver registers one hwmon +class device and build the associated hwmon sysfs I/F for all the registered +ACPI thermal zones. + +/sys/class/hwmon/hwmon[0-*]: + |---name: The type of the thermal zone devices + |---temp[1-*]_input: The current temperature of thermal zone [1-*] + |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] + +Please read Documentation/hwmon/sysfs-interface for additional information. + +*************************** +* Thermal zone attributes * +*************************** + +type + Strings which represent the thermal zone type. + This is given by thermal zone driver as part of registration. + E.g: "acpitz" indicates it's an ACPI thermal device. + In order to keep it consistent with hwmon sys attribute; this should + be a short, lowercase string, not containing spaces nor dashes. + RO, Required + +temp + Current temperature as reported by thermal zone (sensor). + Unit: millidegree Celsius + RO, Required + +mode + One of the predefined values in [enabled, disabled]. + This file gives information about the algorithm that is currently + managing the thermal zone. It can be either default kernel based + algorithm or user space application. + enabled = enable Kernel Thermal management. + disabled = Preventing kernel thermal zone driver actions upon + trip points so that user application can take full + charge of the thermal management. + RW, Optional + +policy + One of the various thermal governors used for a particular zone. + RW, Required + +trip_point_[0-*]_temp + The temperature above which trip point will be fired. + Unit: millidegree Celsius + RO, Optional + +trip_point_[0-*]_type + Strings which indicate the type of the trip point. + E.g. it can be one of critical, hot, passive, active[0-*] for ACPI + thermal zone. + RO, Optional + +trip_point_[0-*]_hyst + The hysteresis value for a trip point, represented as an integer + Unit: Celsius + RW, Optional + +cdev[0-*] + Sysfs link to the thermal cooling device node where the sys I/F + for cooling device throttling control represents. + RO, Optional + +cdev[0-*]_trip_point + The trip point with which cdev[0-*] is associated in this thermal + zone; -1 means the cooling device is not associated with any trip + point. + RO, Optional + +passive + Attribute is only present for zones in which the passive cooling + policy is not supported by native thermal driver. Default is zero + and can be set to a temperature (in millidegrees) to enable a + passive trip point for the zone. Activation is done by polling with + an interval of 1 second. + Unit: millidegrees Celsius + Valid values: 0 (disabled) or greater than 1000 + RW, Optional + +emul_temp + Interface to set the emulated temperature method in thermal zone + (sensor). After setting this temperature, the thermal zone may pass + this temperature to platform emulation function if registered or + cache it locally. This is useful in debugging different temperature + threshold and its associated cooling action. This is write only node + and writing 0 on this node should disable emulation. + Unit: millidegree Celsius + WO, Optional + + WARNING: Be careful while enabling this option on production systems, + because userland can easily disable the thermal policy by simply + flooding this sysfs node with low temperature values. + +***************************** +* Cooling device attributes * +***************************** + +type + String which represents the type of device, e.g: + - for generic ACPI: should be "Fan", "Processor" or "LCD" + - for memory controller device on intel_menlow platform: + should be "Memory controller". + RO, Required + +max_state + The maximum permissible cooling state of this cooling device. + RO, Required + +cur_state + The current cooling state of this cooling device. + The value can any integer numbers between 0 and max_state: + - cur_state == 0 means no cooling + - cur_state == max_state means the maximum cooling. + RW, Required + +3. A simple implementation + +ACPI thermal zone may support multiple trip points like critical, hot, +passive, active. If an ACPI thermal zone supports critical, passive, +active[0] and active[1] at the same time, it may register itself as a +thermal_zone_device (thermal_zone1) with 4 trip points in all. +It has one processor and one fan, which are both registered as +thermal_cooling_device. + +If the processor is listed in _PSL method, and the fan is listed in _AL0 +method, the sys I/F structure will be built like this: + +/sys/class/thermal: + +|thermal_zone1: + |---type: acpitz + |---temp: 37000 + |---mode: enabled + |---policy: step_wise + |---trip_point_0_temp: 100000 + |---trip_point_0_type: critical + |---trip_point_1_temp: 80000 + |---trip_point_1_type: passive + |---trip_point_2_temp: 70000 + |---trip_point_2_type: active0 + |---trip_point_3_temp: 60000 + |---trip_point_3_type: active1 + |---cdev0: --->/sys/class/thermal/cooling_device0 + |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ + |---cdev1: --->/sys/class/thermal/cooling_device3 + |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ + +|cooling_device0: + |---type: Processor + |---max_state: 8 + |---cur_state: 0 + +|cooling_device3: + |---type: Fan + |---max_state: 2 + |---cur_state: 0 + +/sys/class/hwmon: + +|hwmon0: + |---name: acpitz + |---temp1_input: 37000 + |---temp1_crit: 100000 + +4. Event Notification + +The framework includes a simple notification mechanism, in the form of a +netlink event. Netlink socket initialization is done during the _init_ +of the framework. Drivers which intend to use the notification mechanism +just need to call thermal_generate_netlink_event() with two arguments viz +(originator, event). The originator is a pointer to struct thermal_zone_device +from where the event has been originated. An integer which represents the +thermal zone device will be used in the message to identify the zone. The +event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL, +THERMAL_DEV_FAULT}. Notification can be sent when the current temperature +crosses any of the configured thresholds. + +5. Export Symbol APIs: + +5.1: get_tz_trend: +This function returns the trend of a thermal zone, i.e the rate of change +of temperature of the thermal zone. Ideally, the thermal sensor drivers +are supposed to implement the callback. If they don't, the thermal +framework calculated the trend by comparing the previous and the current +temperature values. + +5.2:get_thermal_instance: +This function returns the thermal_instance corresponding to a given +{thermal_zone, cooling_device, trip_point} combination. Returns NULL +if such an instance does not exist. + +5.3:thermal_notify_framework: +This function handles the trip events from sensor drivers. It starts +throttling the cooling devices according to the policy configured. +For CRITICAL and HOT trip points, this notifies the respective drivers, +and does actual throttling for other trip points i.e ACTIVE and PASSIVE. +The throttling policy is based on the configured platform data; if no +platform data is provided, this uses the step_wise throttling policy. + +5.4:thermal_cdev_update: +This function serves as an arbitrator to set the state of a cooling +device. It sets the cooling device to the deepest cooling state if +possible. diff --git a/kernel/Documentation/thermal/x86_pkg_temperature_thermal b/kernel/Documentation/thermal/x86_pkg_temperature_thermal new file mode 100644 index 000000000..17a3a4c0a --- /dev/null +++ b/kernel/Documentation/thermal/x86_pkg_temperature_thermal @@ -0,0 +1,47 @@ +Kernel driver: x86_pkg_temp_thermal +=================== + +Supported chips: +* x86: with package level thermal management +(Verify using: CPUID.06H:EAX[bit 6] =1) + +Authors: Srinivas Pandruvada + +Reference +--- +Intel® 64 and IA-32 Architectures Software Developer’s Manual (Jan, 2013): +Chapter 14.6: PACKAGE LEVEL THERMAL MANAGEMENT + +Description +--------- + +This driver register CPU digital temperature package level sensor as a thermal +zone with maximum two user mode configurable trip points. Number of trip points +depends on the capability of the package. Once the trip point is violated, +user mode can receive notification via thermal notification mechanism and can +take any action to control temperature. + + +Threshold management +-------------------- +Each package will register as a thermal zone under /sys/class/thermal. +Example: +/sys/class/thermal/thermal_zone1 + +This contains two trip points: +- trip_point_0_temp +- trip_point_1_temp + +User can set any temperature between 0 to TJ-Max temperature. Temperature units +are in milli-degree Celsius. Refer to "Documentation/thermal/sysfs-api.txt" for +thermal sys-fs details. + +Any value other than 0 in these trip points, can trigger thermal notifications. +Setting 0, stops sending thermal notifications. + +Thermal notifications: To get kobject-uevent notifications, set the thermal zone +policy to "user_space". For example: echo -n "user_space" > policy + + + + -- cgit 1.2.3-korg