From e09b41010ba33a20a87472ee821fa407a5b8da36 Mon Sep 17 00:00:00 2001 From: José Pekkarinen Date: Mon, 11 Apr 2016 10:41:07 +0300 Subject: These changes are the raw update to linux-4.4.6-rt14. Kernel sources are taken from kernel.org, and rt patch from the rt wiki download page. MIME-Version: 1.0 Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: 8bit During the rebasing, the following patch collided: Force tick interrupt and get rid of softirq magic(I70131fb85). Collisions have been removed because its logic was found on the source already. Change-Id: I7f57a4081d9deaa0d9ccfc41a6c8daccdee3b769 Signed-off-by: José Pekkarinen --- kernel/Documentation/thermal/cpu-cooling-api.txt | 156 ++++++++++++++++++++++- 1 file changed, 155 insertions(+), 1 deletion(-) (limited to 'kernel/Documentation/thermal/cpu-cooling-api.txt') diff --git a/kernel/Documentation/thermal/cpu-cooling-api.txt b/kernel/Documentation/thermal/cpu-cooling-api.txt index 753e47cc2..71653584c 100644 --- a/kernel/Documentation/thermal/cpu-cooling-api.txt +++ b/kernel/Documentation/thermal/cpu-cooling-api.txt @@ -36,8 +36,162 @@ the user. The registration APIs returns the cooling device pointer. np: pointer to the cooling device device tree node clip_cpus: cpumask of cpus where the frequency constraints will happen. -1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) +1.1.3 struct thermal_cooling_device *cpufreq_power_cooling_register( + const struct cpumask *clip_cpus, u32 capacitance, + get_static_t plat_static_func) + +Similar to cpufreq_cooling_register, this function registers a cpufreq +cooling device. Using this function, the cooling device will +implement the power extensions by using a simple cpu power model. The +cpus must have registered their OPPs using the OPP library. + +The additional parameters are needed for the power model (See 2. Power +models). "capacitance" is the dynamic power coefficient (See 2.1 +Dynamic power). "plat_static_func" is a function to calculate the +static power consumed by these cpus (See 2.2 Static power). + +1.1.4 struct thermal_cooling_device *of_cpufreq_power_cooling_register( + struct device_node *np, const struct cpumask *clip_cpus, u32 capacitance, + get_static_t plat_static_func) + +Similar to cpufreq_power_cooling_register, this function register a +cpufreq cooling device with power extensions using the device tree +information supplied by the np parameter. + +1.1.5 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) This interface function unregisters the "thermal-cpufreq-%x" cooling device. cdev: Cooling device pointer which has to be unregistered. + +2. Power models + +The power API registration functions provide a simple power model for +CPUs. The current power is calculated as dynamic + (optionally) +static power. This power model requires that the operating-points of +the CPUs are registered using the kernel's opp library and the +`cpufreq_frequency_table` is assigned to the `struct device` of the +cpu. If you are using CONFIG_CPUFREQ_DT then the +`cpufreq_frequency_table` should already be assigned to the cpu +device. + +The `plat_static_func` parameter of `cpufreq_power_cooling_register()` +and `of_cpufreq_power_cooling_register()` is optional. If you don't +provide it, only dynamic power will be considered. + +2.1 Dynamic power + +The dynamic power consumption of a processor depends on many factors. +For a given processor implementation the primary factors are: + +- The time the processor spends running, consuming dynamic power, as + compared to the time in idle states where dynamic consumption is + negligible. Herein we refer to this as 'utilisation'. +- The voltage and frequency levels as a result of DVFS. The DVFS + level is a dominant factor governing power consumption. +- In running time the 'execution' behaviour (instruction types, memory + access patterns and so forth) causes, in most cases, a second order + variation. In pathological cases this variation can be significant, + but typically it is of a much lesser impact than the factors above. + +A high level dynamic power consumption model may then be represented as: + +Pdyn = f(run) * Voltage^2 * Frequency * Utilisation + +f(run) here represents the described execution behaviour and its +result has a units of Watts/Hz/Volt^2 (this often expressed in +mW/MHz/uVolt^2) + +The detailed behaviour for f(run) could be modelled on-line. However, +in practice, such an on-line model has dependencies on a number of +implementation specific processor support and characterisation +factors. Therefore, in initial implementation that contribution is +represented as a constant coefficient. This is a simplification +consistent with the relative contribution to overall power variation. + +In this simplified representation our model becomes: + +Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation + +Where `capacitance` is a constant that represents an indicative +running time dynamic power coefficient in fundamental units of +mW/MHz/uVolt^2. Typical values for mobile CPUs might lie in range +from 100 to 500. For reference, the approximate values for the SoC in +ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and +140 for the Cortex-A53 cluster. + + +2.2 Static power + +Static leakage power consumption depends on a number of factors. For a +given circuit implementation the primary factors are: + +- Time the circuit spends in each 'power state' +- Temperature +- Operating voltage +- Process grade + +The time the circuit spends in each 'power state' for a given +evaluation period at first order means OFF or ON. However, +'retention' states can also be supported that reduce power during +inactive periods without loss of context. + +Note: The visibility of state entries to the OS can vary, according to +platform specifics, and this can then impact the accuracy of a model +based on OS state information alone. It might be possible in some +cases to extract more accurate information from system resources. + +The temperature, operating voltage and process 'grade' (slow to fast) +of the circuit are all significant factors in static leakage power +consumption. All of these have complex relationships to static power. + +Circuit implementation specific factors include the chosen silicon +process as well as the type, number and size of transistors in both +the logic gates and any RAM elements included. + +The static power consumption modelling must take into account the +power managed regions that are implemented. Taking the example of an +ARM processor cluster, the modelling would take into account whether +each CPU can be powered OFF separately or if only a single power +region is implemented for the complete cluster. + +In one view, there are others, a static power consumption model can +then start from a set of reference values for each power managed +region (e.g. CPU, Cluster/L2) in each state (e.g. ON, OFF) at an +arbitrary process grade, voltage and temperature point. These values +are then scaled for all of the following: the time in each state, the +process grade, the current temperature and the operating voltage. +However, since both implementation specific and complex relationships +dominate the estimate, the appropriate interface to the model from the +cpu cooling device is to provide a function callback that calculates +the static power in this platform. When registering the cpu cooling +device pass a function pointer that follows the `get_static_t` +prototype: + + int plat_get_static(cpumask_t *cpumask, int interval, + unsigned long voltage, u32 &power); + +`cpumask` is the cpumask of the cpus involved in the calculation. +`voltage` is the voltage at which they are operating. The function +should calculate the average static power for the last `interval` +milliseconds. It returns 0 on success, -E* on error. If it +succeeds, it should store the static power in `power`. Reading the +temperature of the cpus described by `cpumask` is left for +plat_get_static() to do as the platform knows best which thermal +sensor is closest to the cpu. + +If `plat_static_func` is NULL, static power is considered to be +negligible for this platform and only dynamic power is considered. + +The platform specific callback can then use any combination of tables +and/or equations to permute the estimated value. Process grade +information is not passed to the model since access to such data, from +on-chip measurement capability or manufacture time data, is platform +specific. + +Note: the significance of static power for CPUs in comparison to +dynamic power is highly dependent on implementation. Given the +potential complexity in implementation, the importance and accuracy of +its inclusion when using cpu cooling devices should be assessed on a +case by case basis. + -- cgit 1.2.3-korg